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MSP430FR5859IDA

MSP430FR5859IDA

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Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, 12-BIT ADC, COMPARATOR, DMA, UART/SPI/I2C, TIMER

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MSP430FR5859IDA

MSP430FR5859IDA

Active
Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, 12-BIT ADC, COMPARATOR, DMA, UART/SPI/I2C, TIMER

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Description

General part information

MSP430FR5859 Series

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

The MSP430 ULP FRAM portfolio consists of a diverse set of devices featuring FRAM, the ULP 16-bit MSP430 CPU, and intelligent peripherals targeted for various applications. The ULP architecture showcases seven low-power modes, optimized to achieve extended battery life in energy-challenged applications.

The MSP430™ ultra-low-power (ULP) FRAM platform combines uniquely embedded FRAM and a holistic ultra-low-power system architecture, allowing innovators to increase performance at lowered energy budgets. FRAM technology combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash at much lower power.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR5859IDA
A/D Channels12 count
A/D Resolution (bits)12 bit
ConnectivityIrDA, USART, I2C, SPI, SCI, UART
Core ProcessorMSP430 CPUXV2
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O31
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package Length0.24 in
Package Name38-TSSOP
Package Width6.1 mm
PeripheralsPWM, POR, Reset, WDT, Brown-out Detect, DMA
Program Memory Depth64 K
Program Memory Size64 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth2 K
RAM Size Width8 bit
Speed16 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MSP430 FRAM Devices Bootloader (BSL) User's Guide (Rev. AB)
Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A)
Enabling secure portable medical devices with TI’s MSP430™ MCU
Industrial Communications Solutions Featuring MSP Microcontrollers
Benchmarking MCU power consumption for ultra-low-power applications
Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)
Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B)
FRAM FAQs
MSP Code Protection Features
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)
MSP430 System-Level ESD Considerations (Rev. B)
Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
ESD Diode Current Specification (Rev. B)
MSP-EXP430FR5969 Quick Start Guide (Rev. A)
Capacitive Touch and MSP Microcontrollers (Rev. A)
Migration from MSP430 FR58xx, FR59xx, and FR6xx to FR4xx and FR2xx (Rev. B)
MSP430 FRAM Quality and Reliability (Rev. A)
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)
Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
MSP430FR586x, MSP430FR584x Mixed-Signal Microcontrollers datasheet (Rev. E)
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology
MSP430FR5969 LaunchPad Development Kit (MSP-EXP430FR5969) User's Guide (Rev. B)
MSP430FR5859 Microcontroller Errata (Rev. Z)
MSP430 MCUs Development Guide Book (Rev. A)
RF430FRL152H Novel Ferroelectric RAM Memory NFC Embedded Tag Based Sensors
MSP430 System ESD Troubleshooting Guide