609-50AB
ActiveWakefield-Vette
HEATSINK FOR .063" PCB
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DocumentsThermal Management for BGAs
609-50AB
ActiveWakefield-Vette
HEATSINK FOR .063" PCB
Deep-Dive with AI
DocumentsThermal Management for BGAs
Technical Specifications
Parameters and characteristics for this part
| Specification | 609-50AB | 
|---|---|
| Attachment Method | Clip, Thermal Material | 
| Fin Height [z] | 12.7 mm | 
| Fin Height [z] | 0.5 in | 
| Length [x] | 2.895 " | 
| Length [x] | 73.53 mm | 
| Material | Aluminum | 
| Material Finish | Black Anodized | 
| Package Cooled | ASIC, BGA, LGA, CPU | 
| Shape | Rectangular, Pin Fins | 
| Thermal Resistance @ Forced Air Flow | 2.5 °C/W, 250 LFM | 
| Type | Top Mount | 
| Width [x] | 2 in | 
| Width [x] | 50.8 mm | 
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
Description
General part information
609-50 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Documents
Technical documentation and resources