HEATSINK FOR .063" PCB
| Part | Material | Width [x] | Width [x] | Package Cooled | Thermal Resistance @ Forced Air Flow | Material Finish | Attachment Method | Fin Height [z] | Fin Height [z] | Shape | Length [x] | Length [x] | Type | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield-Vette  | Aluminum  | 2 in  | 50.8 mm  | ASIC  BGA  CPU  LGA  | 2.5 °C/W  250 LFM  | Black Anodized  | Clip  Thermal Material  | 12.7 mm  | 0.5 in  | Rectangular  Pin Fins  | 2.895 "  | 73.53 mm  | Top Mount  |