36-3552-10

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Aries Electronics

36P DIP TIN BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Aries Electronics

36P DIP TIN BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	36-3552-10

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	36
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	7.62 mm
Type	0.3 in
Type	DIP, ZIF (ZIP)

Part	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination	Type	Type	Type	Termination Post Length	Termination Post Length	Contact Material - Post	Number of Positions or Pins (Grid)	Features	Housing Material	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Mounting Type	Contact Finish - Mating
Aries Electronics 36-3552-10	0.1 in	2.54 mm	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Beryllium Copper	36	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	5.08 µm	200 µin	Beryllium Copper	200 µin	5.08 µm	Tin	Through Hole
Aries Electronics 36-3552-11	0.1 in	2.54 mm	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Beryllium Copper	36	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0			Beryllium Copper			Gold	Through Hole	Gold
Aries Electronics 36-3552-16	0.1 in	2.54 mm	1 A	2.54 mm	0.1 in	Solder	7.62 mm	0.3 in	DIP ZIF (ZIP)	0.11 in	2.78 mm	Beryllium Copper	36	Closed Frame	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	1.27 µm	50 µin	Beryllium Copper	50 µin	1.27 µm	Nickel Boron	Through Hole	Nickel Boron

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

36 (2 x 18) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Tin Through Hole

Technical documentation and resources