Beta
⌘K
36P DIP TIN BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Pitch - Post | Pitch - Post | Termination | Type | Type | Type | Termination Post Length | Termination Post Length | Contact Material - Post | Number of Positions or Pins (Grid) | Features | Housing Material | Material Flammability Rating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Mounting Type | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | 1 A | 2.54 mm | 0.1 in | Solder | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 0.11 in | 2.78 mm | Beryllium Copper | 36 | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | 5.08 µm | 200 µin | Beryllium Copper | 200 µin | 5.08 µm | Tin | Through Hole | |
Aries Electronics | 0.1 in | 2.54 mm | 1 A | 2.54 mm | 0.1 in | Solder | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 0.11 in | 2.78 mm | Beryllium Copper | 36 | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Beryllium Copper | Gold | Through Hole | Gold | ||||
Aries Electronics | 0.1 in | 2.54 mm | 1 A | 2.54 mm | 0.1 in | Solder | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 0.11 in | 2.78 mm | Beryllium Copper | 36 | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | 1.27 µm | 50 µin | Beryllium Copper | 50 µin | 1.27 µm | Nickel Boron | Through Hole | Nickel Boron |