MM908 Series

Part	Controller Series	RAM Size Depth	RAM Size Width	Applications	Grade	Program Memory Size (FLASH)	Program Memory Type	Operating Temperature (Min)	Operating Temperature (Max)	Mounting Type	Core Processor	Number of I/O	Package Name	Package Length	Package Width	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Interface	Package Features
NXP USA Inc. MM908E624ACEWR2	908E	512	8 bit	Mirror Control	Automotive	16 kB	FLASH	-40 °C	85 °C	Surface Mount	HC08	16	54-BSSOP 54-SOIC	0.295 in	7.5 mm	5.5 V	18 V	SCI SPI
NXP USA Inc. MM908E625ACPEK	908E	512	8 bit	Mirror Control	Automotive	16 kB	FLASH	-40 °C	85 °C	Surface Mount	HC08		54-SOIC-EP 54-SSOP	0.295 in	7.5 mm	8 V	18 V	SCI SPI	Exposed Pad
NXP USA Inc. MM908E625ACPEKR2	908E	512	8 bit	Mirror Control	Automotive	16 kB	FLASH	-40 °C	85 °C	Surface Mount	HC08		54-SOIC-EP 54-SSOP	0.295 in	7.5 mm	8 V	18 V	SCI SPI	Exposed Pad
NXP USA Inc. MM908E626AVEK	908E	512	8 bit	Mirror Control	Automotive	16 kB	FLASH	-40 °C	115 °C	Surface Mount	HC08		54-SOIC-EP 54-SSOP	0.295 in	7.5 mm	8 V	18 V	SCI SPI	Exposed Pad
NXP USA Inc. MM908E621ACPEK	908E	512	8 bit	Mirror Control	Automotive	16 kB	FLASH	-40 °C	85 °C	Surface Mount	HC08	12	54-SOIC-EP 54-SSOP	0.295 in	7.5 mm	9 VDC	16 V	SCI SPI	Exposed Pad
NXP USA Inc. MM908E626AVDWB	908E	512	8 bit	Mirror Control	Automotive	16 kB	FLASH	-40 °C	115 °C	Surface Mount	HC08		54-SOIC-EP 54-SSOP	0.295 in	7.5 mm	8 V	18 V	SCI SPI	Exposed Pad
NXP USA Inc. MM908E626AVEK	908E	512	8 bit	Mirror Control	Automotive	16 kB	FLASH	-40 °C	115 °C	Surface Mount	HC08		54-SOIC-EP 54-SSOP	0.295 in	7.5 mm	8 V	18 V	SCI SPI	Exposed Pad

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