MM908 Series
Manufacturer: NXP USA Inc.
IC SWITCH TRPL HI MCU/LIN 54SOIC
| Part | Controller Series | RAM Size Depth | RAM Size Width | Applications | Grade | Program Memory Size (FLASH) | Program Memory Type | Operating Temperature (Min) | Operating Temperature (Max) | Mounting Type | Core Processor | Number of I/O | Package Name | Package Length | Package Width | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Interface | Package Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | 908E | 512 | 8 bit | Mirror Control | Automotive | 16 kB | FLASH | -40 °C | 85 °C | Surface Mount | HC08 | 16 | 54-BSSOP 54-SOIC | 0.295 in | 7.5 mm | 5.5 V | 18 V | SCI SPI | |
NXP USA Inc. | 908E | 512 | 8 bit | Mirror Control | Automotive | 16 kB | FLASH | -40 °C | 85 °C | Surface Mount | HC08 | 54-SOIC-EP 54-SSOP | 0.295 in | 7.5 mm | 8 V | 18 V | SCI SPI | Exposed Pad | |
NXP USA Inc. | 908E | 512 | 8 bit | Mirror Control | Automotive | 16 kB | FLASH | -40 °C | 85 °C | Surface Mount | HC08 | 54-SOIC-EP 54-SSOP | 0.295 in | 7.5 mm | 8 V | 18 V | SCI SPI | Exposed Pad | |
NXP USA Inc. | 908E | 512 | 8 bit | Mirror Control | Automotive | 16 kB | FLASH | -40 °C | 115 °C | Surface Mount | HC08 | 54-SOIC-EP 54-SSOP | 0.295 in | 7.5 mm | 8 V | 18 V | SCI SPI | Exposed Pad | |
NXP USA Inc. | 908E | 512 | 8 bit | Mirror Control | Automotive | 16 kB | FLASH | -40 °C | 85 °C | Surface Mount | HC08 | 12 | 54-SOIC-EP 54-SSOP | 0.295 in | 7.5 mm | 9 VDC | 16 V | SCI SPI | Exposed Pad |
NXP USA Inc. | 908E | 512 | 8 bit | Mirror Control | Automotive | 16 kB | FLASH | -40 °C | 115 °C | Surface Mount | HC08 | 54-SOIC-EP 54-SSOP | 0.295 in | 7.5 mm | 8 V | 18 V | SCI SPI | Exposed Pad | |
NXP USA Inc. | 908E | 512 | 8 bit | Mirror Control | Automotive | 16 kB | FLASH | -40 °C | 115 °C | Surface Mount | HC08 | 54-SOIC-EP 54-SSOP | 0.295 in | 7.5 mm | 8 V | 18 V | SCI SPI | Exposed Pad |