SMDLTLFP15T4
ActiveChip Quik Inc.
TWO PART MIX SOLDER PASTE
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SMDLTLFP15T4
ActiveChip Quik Inc.
TWO PART MIX SOLDER PASTE
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SMDLTLFP15T4 |
|---|---|
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Flux Type | No-Clean |
| Form | 0.53 oz |
| Form | Jar |
| Form | 15 g |
| Melting Point [custom] | 138 °C |
| Melting Point [custom] | 281 °F |
| Mesh Type [custom] | 4 |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature [Max] | 25 °C |
| Storage/Refrigeration Temperature [Max] | 77 °F |
| Storage/Refrigeration Temperature [Min] | 37 °F |
| Storage/Refrigeration Temperature [Min] | 3 °C |
| Type | Solder Paste, Two Part Mix |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 19.95 | |
Description
General part information
SMDLTL Series
Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g)
Documents
Technical documentation and resources