SMDLTL Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
TWO PART MIX SOLDER PASTE
| Part | Melting Point | Shelf Life Start | Process | Type | Ag Composition | Composition Elements | Composition Formula | Bi Composition | Sn Composition | Form | Form Weight | Mesh Type | Shelf Life | Storage/Refrigeration Temperature (Minimum) | Storage/Refrigeration Temperature (Maximum) | Shipping Info |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | 281 °F | Date of Manufacture | Lead Free | Solder Paste Two Part Mix | 0.4 % | Ag Bi Sn | Bi57.6Sn42Ag0.4 | 57.6 % | 42 % | Jar | 0.53 oz | 4 | 24 Months | 37 °F | 77 °F | |
 Chip Quik Inc. | 281 °F | Date of Manufacture | Lead Free | Solder Paste | 0.4 % | Ag Bi Sn | Bi57.6Sn42Ag0.4 | 57.6 % | 42 % | Cartridge | 17.64 oz | 4 | 6 Months | 37 °F | 46 °F | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. |
 Chip Quik Inc. | 281 °F | Date of Manufacture | Lead Free | Solder Paste | 0.4 % | Ag Bi Sn | Bi57.6Sn42Ag0.4 | 57.6 % | 42 % | Cartridge | 17.64 oz | 3 | 6 Months | 37 °F | 46 °F | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. |