
2N7002BKS,115
ActiveNexperia USA Inc.
60 V, 300 MA DUAL N-CHANNEL TRENCH MOSFET

2N7002BKS,115
ActiveNexperia USA Inc.
60 V, 300 MA DUAL N-CHANNEL TRENCH MOSFET
Description
General part information
2N7002 Series
N-channel enhancement mode Field-Effect Transistor (FET) in an ultra small DFN1110D-3 (SOT8015) leadless Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | 2N7002BKS,115 |
|---|---|
| Channel Count | 2 |
| Configuration | N-Channel |
| Configuration - Features | Dual |
| Current - Continuous Drain (Id) (Ta) | 300 mA |
| Drain to Source Voltage (Vdss) | 60 V |
| FET Feature | Logic Level Gate |
| Gate Charge (Max) | 0.6 nC, 0.6 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 50 pF |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | 6-TSSOP, SC-88, SOT-363 |
| Package Name | 6-TSSOP |
| Power - Max | 295 mW |
| Qualification | AEC-Q101 |
| Rds On (Max) | 1.6 Ohm |
| Technology | MOSFET (Metal Oxide) |
| Vgs(th) (Max) | 2.1 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
TSSOP6 ; Reel pack for SMD, 7"; Q3/T4 product orientation
Nexperia package poster
Understanding power MOSFET data sheet parameters
Power MOSFET frequently asked questions and answers
LFPAK MOSFET thermal design guide - Part 2
Wave soldering profile
RC Thermal Models
Failure signature of Electrical Overstress on Power MOSFETs
Understanding power MOSFET data sheet parameters
TSSOP6; Reel pack for SMD, 7"; Q2/T3 product orientation
plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body
Using power MOSFETs in parallel
PicoGate leaded logic portfolio guide
Questions about package outline drawings
Power MOSFET single-shot and repetitive avalanche ruggedness rating
Low temperature soldering, application study
LFPAK MOSFET thermal design guide, Chinese version
MAR_SOT363 Topmark
plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body
Reflow soldering profile