Specification	609-50AB

Attachment Method	Clip, Thermal Material
Fin Height	0.5 in
Length	2.895 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC...), BGA, ASIC, LGA, CPU, Assorted (BGA
Shape	Pin Fins, Rectangular
Thermal Resistance	2.5 °C/W
Type	Top Mount
Width	2 in

609-50 Series

Part	Thermal Resistance	Width	Attachment Method	Package Cooled	Length	Shape	Fin Height	Type	Material	Material Finish
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	2 in	Clip Thermal Material	ASIC ASIC...) Assorted (BGA BGA CPU LGA	2.895 in	Pin Fins Rectangular	0.5 in	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	2 in	Clip Thermal Material	ASIC ASIC...) Assorted (BGA BGA CPU LGA	2.895 in	Pin Fins Rectangular	0.5 in	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	2 in	Clip Thermal Material	ASIC ASIC...) Assorted (BGA BGA CPU LGA	2.895 in	Pin Fins Rectangular	0.5 in	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	2 in	Clip Thermal Material	ASIC ASIC...) Assorted (BGA BGA CPU LGA	2.895 in	Pin Fins Rectangular	0.5 in	Top Mount	Aluminum	Black Anodized

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources