609-50 Series

Catalog

HEATSINK FOR .063" PCB

Part	Thermal Resistance	Width	Attachment Method	Package Cooled	Length	Shape	Fin Height	Type	Material	Material Finish
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	2 in	Clip Thermal Material	ASIC ASIC...) Assorted (BGA BGA CPU LGA	2.895 in	Pin Fins Rectangular	0.5 in	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50AB	2.5 °C/W	2 in	Clip Thermal Material	ASIC ASIC...) Assorted (BGA BGA CPU LGA	2.895 in	Pin Fins Rectangular	0.5 in	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	2 in	Clip Thermal Material	ASIC ASIC...) Assorted (BGA BGA CPU LGA	2.895 in	Pin Fins Rectangular	0.5 in	Top Mount	Aluminum	Black Anodized
Wakefield Thermal Solutions 609-50ABS3	2.5 °C/W	2 in	Clip Thermal Material	ASIC ASIC...) Assorted (BGA BGA CPU LGA	2.895 in	Pin Fins Rectangular	0.5 in	Top Mount	Aluminum	Black Anodized