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TSSOP (DGG)

MSP430FR69221IG56R

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Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, LCD, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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TSSOP (DGG)

MSP430FR69221IG56R

Active
Texas Instruments

16 MHZ MCU WITH 64KB FRAM, 2KB SRAM, LCD, AES, 12-BIT ADC , COMPARATOR, DMA, UART/SPI/I2C, TIMER

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Description

General part information

MSP430FR69221 Series

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

This ultra-low-power MSP430FRxx FRAM microcontroller family consists of several devices featuring embedded nonvolatile FRAM, a 16-bit CPU, and different sets of peripherals targeted for various applications. The architecture, FRAM, and peripherals, combined with seven low-power modes, are optimized to achieve extended battery life in portable and wireless sensing applications. FRAM is a new nonvolatile memory that combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash, all at lower total power consumption.

Technical Specifications

Parameters and characteristics for this part

SpecificationMSP430FR69221IG56R
A/D Channels8 count
A/D Resolution (bits)12 bit
ConnectivityIrDA, USART, I2C, SPI, SCI, UART
Core ProcessorMSP430 CPUXV2
Core Size (Bit Width)16 Bit
Mounting TypeSurface Mount
Number of I/O46
Operating Temperature (Max)85 °C
Operating Temperature (Min)-40 °C
Oscillator TypeInternal
Package Length0.24 in
Package Name56-TSSOP, 56-TFSOP
Package Width6.1 mm
PeripheralsLCD, DMA, PWM, POR, Reset, WDT, Brown-out Detect
Program Memory Depth64 K
Program Memory Size64 KB
Program Memory TypeFRAM
Program Memory Width8 bit
RAM Size Depth2 K
RAM Size Width8 bit
Speed16 MHz
Voltage - Supply (Vcc/Vdd) Maximum3.6 V
Voltage - Supply (Vcc/Vdd) Minimum1.8 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

MSP430FR69221 Device Erratasheet (Rev. S)
MSP430 FRAM Technology – How To and Best Practices (Rev. B)
Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
Random Number Generation Using MSP430FR59xx and MSP430FR69xx Microcontrollers
MSP430FR58xx, MSP430FR59xx, and MSP430FR6xx Family User's Guide (Rev. P)
System advantages of mixed signal integration
ESD Diode Current Specification (Rev. B)
Migrating From MSP430F4xx Family to MSP430FR58xx/FR59xx/FR68xx/FR69xx Family (Rev. B)
Capacitive Touch and MSP Microcontrollers (Rev. A)
Benchmarking MCU power consumption for ultra-low-power applications
MSP430 System ESD Troubleshooting Guide
MSP430 Advanced Power Optimizations: ULP Advisor SW and EnergyTrace Technology
Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers
FRAM FAQs
MSP430 System-Level ESD Considerations (Rev. B)
General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
Crypto-Bootloader (CryptoBSL) for MSP430FR59xx and MSP430FR69xx MCUs
Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
Designing With MSP430™ MCUs and Segment LCDs (Rev. A)
Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A)
Designing With the MSP430FR58xx, FR59xx, FR68xx, and FR69xx ADC (Rev. A)
MSP430FR697x(1), MSP430FR687x(1), MSP430FR692x(1), MSP430FR682x(1) Mixed‑Signal Microcontrollers datasheet (Rev. E)
Getting Started With EEMBC ULPBench on MSP-EXP430FR5969 (Rev. A)
MSP430 MCUs Development Guide Book (Rev. A)
MSP430 FRAM Quality and Reliability (Rev. A)
MSP Code Protection Features
Secure In-Field Firmware Updates for MSP MCUs
MSP430FR58,59,68,69xx User Guide