
APF30-30-10CB
ActiveCTS Thermal Management Products
HEATSINK LOW-PROFILE FORGED

APF30-30-10CB
ActiveCTS Thermal Management Products
HEATSINK LOW-PROFILE FORGED
Description
General part information
APF30 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Technical Specifications
Parameters and characteristics for this part
| Specification | APF30-30-10CB |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Fin Height | 0.37 in |
| Length | 1.181 in |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | ASIC...), BGA, ASIC, LGA, CPU, Assorted (BGA |
| Shape | Square, Fins |
| Thermal Resistance | 3.3 °C/W |
| Type | Top Mount |
| Width | 1.181 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources