HMTSW-118-08-L-D-354

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Samtec Inc.

CONN UNSHROUDED HEADER HDR 36 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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HMTSW-118-08-L-D-354

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Samtec Inc.

CONN UNSHROUDED HEADER HDR 36 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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Technical Specifications

Parameters and characteristics for this part

Specification	HMTSW-118-08-L-D-354

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Length - Mating	0.354 in
Contact Length - Mating	9 mm
Contact Length - Post	1.93 mm
Contact Length - Post	0.076 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3 A
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.1 in
Insulation Height	2.54 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	36
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	13.46 mm
Overall Contact Length	0.53 in
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

HMTSW-118 Series

Part	Overall Contact Length	Overall Contact Length	Shrouding	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Type	Material Flammability Rating	Fastening Type	Contact Finish - Mating	Contact Length - Post	Contact Length - Post	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Color	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Style	Current Rating (Amps)	Termination	Number of Positions	Contact Shape	Number of Rows	Insulation Height	Insulation Height	Number of Positions Loaded	Insulation Material	Connector Type	Contact Material	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Mating	Contact Length - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Mating [x]
Samtec Inc. HMTSW-118-08-S-S-000	13.46 mm	0.53 in	Unshrouded	0.1 in	2.54 mm	Through Hole	Male Pin	UL94 V-0	Push-Pull	Gold	0.43 in	10.92 mm	-55 °C	125 °C	Natural	30 Áin	0.76 Ám	Tin	Board to Board Cable	3 A	Solder	18	Square	1	0.1 in	2.54 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze
Samtec Inc. HMTSW-118-07-S-D-120	10.92 mm	0.43 in	Unshrouded	0.1 in	2.54 mm	Through Hole	Male Pin	UL94 V-0	Push-Pull	Gold			-55 °C	125 °C	Natural	30 Áin	0.76 Ám	Tin	Board to Board Cable	3 A	Solder	36	Square	2	0.1 in	2.54 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze	0.21 in	5.33 mm	3.05 mm	0.12 in	2.54 mm	0.1 in
Samtec Inc. HMTSW-118-07-G-D-130-RA			Unshrouded	0.1 in	2.54 mm	Through Hole Right Angle	Male Pin	UL94 V-0	Push-Pull	Gold			-55 °C	125 °C	Natural	10 çin	0.25 çm	Gold	Board to Board Cable	3 A	Solder	36	Square	2	0.24 in	6.1 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze			3.3 mm	0.13 in	2.54 mm	0.1 in	3 µin	0.076 µm
Samtec Inc. HMTSW-118-08-L-D-340	13.46 mm	0.53 in	Unshrouded	0.1 in	2.54 mm	Through Hole	Male Pin	UL94 V-0	Push-Pull	Gold	0.09 "	2.29 mm	-55 °C	125 °C	Natural	10 çin	0.25 çm	Tin	Board to Board Cable	3 A	Solder	36	Square	2	0.1 in	2.54 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze			8.64 mm	0.34 in	2.54 mm	0.1 in
Samtec Inc. HMTSW-118-28-G-D-230-RA			Unshrouded	0.1 in	2.54 mm	Through Hole Right Angle	Male Pin	UL94 V-0	Push-Pull	Gold			-55 °C	125 °C	Natural	10 çin	0.25 çm	Gold	Board to Board Cable	3 A	Solder	36	Square	2	0.24 in	6.1 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze			5.84 mm		2.54 mm	0.1 in	3 µin	0.076 µm	0.23 in
Samtec Inc. HMTSW-118-07-G-D-150	10.92 mm	0.43 in	Unshrouded	0.1 in	2.54 mm	Through Hole	Male Pin	UL94 V-0	Push-Pull	Gold	0.18 in	4.57 mm	-55 °C	125 °C	Natural	10 çin	0.25 çm	Gold	Board to Board Cable	3 A	Solder	36	Square	2	0.1 in	2.54 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze			3.81 mm	0.15 in	2.54 mm	0.1 in	3 µin	0.076 µm
Samtec Inc. HMTSW-118-11-H-D-685	23.62 mm	0.93 in	Unshrouded	0.1 in	2.54 mm	Through Hole	Male Pin	UL94 V-0	Push-Pull	Gold	0.145 in	3.68 mm	-55 °C	125 °C	Natural	30 Áin	0.76 Ám	Gold	Board to Board Cable	3 A	Solder	36	Square	2	0.1 in	2.54 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze			17.4 mm	0.685 in	2.54 mm	0.1 in	3 µin	0.076 µm
Samtec Inc. HMTSW-118-24-T-S-120-RA			Unshrouded	0.1 in	2.54 mm	Through Hole Right Angle	Male Pin	UL94 V-0	Push-Pull				-55 °C	105 ░C	Natural			Tin	Board to Board Cable	3 A	Solder	18	Square	1	0.122 in	3.1 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze			3.05 mm	0.12 in
Samtec Inc. HMTSW-118-24-L-D-270	12.19 mm	0.48 in	Unshrouded	0.1 in	2.54 mm	Through Hole	Male Pin	UL94 V-0	Push-Pull	Gold		2.79 mm	-55 °C	125 °C	Natural	10 çin	0.25 çm	Tin	Board to Board Cable	3 A	Solder	36	Square	2	0.1 in	2.54 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze	0.11 in		6.86 mm	0.27 in	2.54 mm	0.1 in
Samtec Inc. HMTSW-118-08-L-D-354	13.46 mm	0.53 in	Unshrouded	0.1 in	2.54 mm	Through Hole	Male Pin	UL94 V-0	Push-Pull	Gold	0.076 in	1.93 mm	-55 °C	125 °C	Natural	10 çin	0.25 çm	Tin	Board to Board Cable	3 A	Solder	36	Square	2	0.1 in	2.54 mm	All	Liquid Crystal Polymer (LCP)	Header	Phosphor Bronze			9 mm	0.354 in	2.54 mm	0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Arrow	N/A	1	$ 2.66
		25	$ 2.54
		50	$ 2.48
		100	$ 2.33
Digikey	Bulk	1	$ 6.40

Description

General part information

HMTSW-118 Series

Connector Header Through Hole 36 position 0.100" (2.54mm)

Documents

Technical documentation and resources