HMTSW-118 Series

Catalog

CONN UNSHROUDED HEADER HDR 18 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Part	Insulation Material	Overall Contact Length	Number of Rows	Contact Shape	Insulation Height	Fastening Type	Insulation Color	Contact Material	Connector Type	Contact Finish - Mating	Mounting Type	Contact Finish Thickness - Mating	Contact Type	Contact Length - Post	Shrouding	Operating Temperature (Max)	Operating Temperature (Min)	Number of Positions Loaded	Number of Positions	Termination	Pitch - Mating	Style	Contact Finish - Post	Current Rating	Material Flammability Rating	Contact Length - Mating	Row Spacing - Mating	Contact Finish Thickness - Post
Samtec Inc. HMTSW-118-08-S-S-000	Liquid Crystal Polymer (LCP)	0.53 in	1	Square	0.1 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Through Hole	30 µin	Male Pin	0.43 in	Unshrouded	125 °C	-55 °C	All	18	Solder	0.1 in	Board Board or Cable	Tin	3 A	UL94 V-0
Samtec Inc. HMTSW-118-07-S-D-120	Liquid Crystal Polymer (LCP)	0.43 in	2	Square	0.1 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Through Hole	30 µin	Male Pin	0.21 in	Unshrouded	125 °C	-55 °C	All	36	Solder	0.1 in	Board Board or Cable	Tin	3 A	UL94 V-0	0.12 in	0.1 in
Samtec Inc. HMTSW-118-07-G-D-130-RA	Liquid Crystal Polymer (LCP)		2	Square	0.24 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Right Angle Through Hole	10 µin	Male Pin		Unshrouded	125 °C	-55 °C	All	36	Solder	0.1 in	Board Board or Cable	Gold	3 A	UL94 V-0	0.13 in	0.1 in	3 µin
Samtec Inc. HMTSW-118-08-G-S-120-RA	Liquid Crystal Polymer (LCP)		1	Square	0.122 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Right Angle Through Hole	10 µin	Male Pin		Unshrouded	125 °C	-55 °C	All	18	Solder	0.1 in	Board Board or Cable	Gold	3 A	UL94 V-0	0.12 in		3 µin
Samtec Inc. HMTSW-118-24-S-D-226	Liquid Crystal Polymer (LCP)	0.48 in	2	Square	0.1 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Through Hole	30 µin	Male Pin	0.154 in	Unshrouded	125 °C	-55 °C	All	36	Solder	0.1 in	Board Board or Cable	Tin	3 A	UL94 V-0	0.226 in	0.1 in
Samtec Inc. HMTSW-118-28-G-D-230-RA	Liquid Crystal Polymer (LCP)		2	Square	0.24 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Right Angle Through Hole	10 µin	Male Pin		Unshrouded	125 °C	-55 °C	All	36	Solder	0.1 in	Board Board or Cable	Gold	3 A	UL94 V-0	0.23 in	0.1 in	3 µin
Samtec Inc. HMTSW-118-07-G-D-240	Liquid Crystal Polymer (LCP)	0.43 in	2	Square	0.1 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Through Hole	10 µin	Male Pin	0.09 in	Unshrouded	125 °C	-55 °C	All	36	Solder	0.1 in	Board Board or Cable	Gold	3 A	UL94 V-0	0.24 in	0.1 in	3 µin
Samtec Inc. HMTSW-118-09-S-D-410	Liquid Crystal Polymer (LCP)	0.73 in	2	Square	0.1 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Through Hole	30 µin	Male Pin	0.22 in	Unshrouded	125 °C	-55 °C	All	36	Solder	0.1 in	Board Board or Cable	Tin	3 A	UL94 V-0	0.41 in	0.1 in
Samtec Inc. HMTSW-118-07-G-D-150	Liquid Crystal Polymer (LCP)	0.43 in	2	Square	0.1 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Through Hole	10 µin	Male Pin	0.18 in	Unshrouded	125 °C	-55 °C	All	36	Solder	0.1 in	Board Board or Cable	Gold	3 A	UL94 V-0	0.15 in	0.1 in	3 µin
Samtec Inc. HMTSW-118-11-H-D-685	Liquid Crystal Polymer (LCP)	0.93 in	2	Square	0.1 in	Push-Pull	Natural	Phosphor Bronze	Header	Gold	Through Hole	30 µin	Male Pin	0.145 in	Unshrouded	125 °C	-55 °C	All	36	Solder	0.1 in	Board Board or Cable	Gold	3 A	UL94 V-0	0.685 in	0.1 in	3 µin