Specification	XCR3512XL-10FG324I

Delay Time tpd(1) Max	9 ns
Mounting Type	Surface Mount
Number of Gates	12000
Number of I/O	260
Number of Logic Elements/Blocks	32
Number of Macrocells	512
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Package / Case	324-BBGA
Package Length	23 mm
Package Name	324-FBGA
Package Width	23 mm
Program/Erase Cycles (Minimum)	1 K cycles
Programmable Type	In System Programmable
Voltage Supply - Internal (Maximum)	3.6 V
Voltage Supply - Internal (Minimum)	2.7 V

XCR3512 Series

Part	Mounting Type	Number of Macrocells	Number of Logic Elements/Blocks	Operating Temperature (Max)	Operating Temperature (Min)	Delay Time tpd(1) Max	Program/Erase Cycles (Minimum)	Programmable Type	Number of Gates	Package Name	Package Length	Package Width	Voltage Supply - Internal (Minimum)	Voltage Supply - Internal (Maximum)	Number of I/O	Package / Case
AMD / Xilinx XCR3512XL-12FG324I	Surface Mount	512	32	85 °C	-40 °C	10.8 ns	1 K cycles	In System Programmable	12000	324-FBGA	23 mm	23 mm	2.7 V	3.6 V	260	324-BBGA
AMD / Xilinx XCR3512XL-7FTG256C	Surface Mount	512	32	70 °C	0 °C	7 ns	1 K cycles	In System Programmable	12000	256-FTBGA	17 mm	17 mm	3 V	3.6 V	212	256-LBGA
AMD / Xilinx XCR3512XL-12FTG256C	Surface Mount	512	32	70 °C	0 °C	10.8 ns	1 K cycles	In System Programmable	12000	256-FTBGA	17 mm	17 mm	3 V	3.6 V	212	256-LBGA
AMD / Xilinx XCR3512XL-7FT256C	Surface Mount	512	32	70 °C	0 °C	7 ns	1 K cycles	In System Programmable	12000	256-FTBGA	17 mm	17 mm	3 V	3.6 V	212	256-LBGA
AMD / Xilinx XCR3512XL-10FG324I	Surface Mount	512	32	85 °C	-40 °C	9 ns	1 K cycles	In System Programmable	12000	324-FBGA	23 mm	23 mm	2.7 V	3.6 V	260	324-BBGA
AMD / Xilinx XCR3512XL-7PQ208C	Surface Mount	512	32	70 °C	0 °C	7 ns	1 K cycles	In System Programmable	12000	208-PQFP	28 mm	28 mm	3 V	3.6 V	180	208-BFQFP
AMD / Xilinx XCR3512XL-10FT256C	Surface Mount	512	32	70 °C	0 °C	9 ns	1 K cycles	In System Programmable	12000	256-FTBGA	17 mm	17 mm	3 V	3.6 V	212	256-LBGA

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