XCR3512 Series
Manufacturer: AMD / Xilinx
IC CPLD 512MC 10.8NS 324FBGA
| Part | Mounting Type | Number of Macrocells | Number of Logic Elements/Blocks | Operating Temperature (Max) | Operating Temperature (Min) | Delay Time tpd(1) Max | Program/Erase Cycles (Minimum) | Programmable Type | Number of Gates | Package Name | Package Length | Package Width | Voltage Supply - Internal (Minimum) | Voltage Supply - Internal (Maximum) | Number of I/O | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AMD / Xilinx | Surface Mount | 512 | 32 | 85 °C | -40 °C | 10.8 ns | 1 K cycles | In System Programmable | 12000 | 324-FBGA | 23 mm | 23 mm | 2.7 V | 3.6 V | 260 | 324-BBGA |
AMD / Xilinx | Surface Mount | 512 | 32 | 70 °C | 0 °C | 7 ns | 1 K cycles | In System Programmable | 12000 | 256-FTBGA | 17 mm | 17 mm | 3 V | 3.6 V | 212 | 256-LBGA |
AMD / Xilinx | Surface Mount | 512 | 32 | 70 °C | 0 °C | 10.8 ns | 1 K cycles | In System Programmable | 12000 | 256-FTBGA | 17 mm | 17 mm | 3 V | 3.6 V | 212 | 256-LBGA |
AMD / Xilinx | Surface Mount | 512 | 32 | 70 °C | 0 °C | 7 ns | 1 K cycles | In System Programmable | 12000 | 256-FTBGA | 17 mm | 17 mm | 3 V | 3.6 V | 212 | 256-LBGA |
AMD / Xilinx | Surface Mount | 512 | 32 | 85 °C | -40 °C | 9 ns | 1 K cycles | In System Programmable | 12000 | 324-FBGA | 23 mm | 23 mm | 2.7 V | 3.6 V | 260 | 324-BBGA |
AMD / Xilinx | Surface Mount | 512 | 32 | 70 °C | 0 °C | 7 ns | 1 K cycles | In System Programmable | 12000 | 208-PQFP | 28 mm | 28 mm | 3 V | 3.6 V | 180 | 208-BFQFP |
AMD / Xilinx | Surface Mount | 512 | 32 | 70 °C | 0 °C | 9 ns | 1 K cycles | In System Programmable | 12000 | 256-FTBGA | 17 mm | 17 mm | 3 V | 3.6 V | 212 | 256-LBGA |