248-1282-29-0602J

Active

3M Electronic Specialty

IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER

248-1282-29-0602J

Active

3M Electronic Specialty

IC & COMPONENT SOCKET, 48 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER

Description Specifications Series Pricing CAD Documents

Description

General part information

248 Series

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole

Technical Specifications

Parameters and characteristics for this part

Specification	248-1282-29-0602J

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	30 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Convert From (Adapter End)	DIP
Convert From (Adapter End) Row Spacing	0.6 "
Convert From (Adapter End) Type	DIP, Row Spacing
Convert To (Adapter End) Size	0.6 in
Convert To (Adapter End) Type	Row Spacing, DIP
Current Rating	1 A
Features	Closed Frame
Housing Material	Polysulfone, PSU, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Pins	48
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.13 in

248 Series

Part	Type	Contact Material - Mating	Contact Material - Post	Housing Material	Contact Finish - Post	Features	Termination	Pitch - Mating	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Finish - Mating	Mounting Type	Contact Resistance	Termination Post Length	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Convert From (Adapter End)	Convert From (Adapter End) Type	Convert From (Adapter End) Row Spacing	Pitch - Post	Number of Pins	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Current Rating	Material Flammability Rating	Operating Temperature (Max)	Operating Temperature (Min)
3M Electronic Specialty 248-5205-01	QFN	Beryllium Copper	Beryllium Copper	PES Polyethersulfone	Gold	Closed Frame	Solder	0.02 in	4	12	48	Gold	Through Hole	25 mOhm	0.118 in
3M Electronic Specialty 248-1282-19-0602J		Beryllium Copper	Beryllium Copper	Glass Filled Polysulfone PSU	Gold	Closed Frame	Wire Wrap	0.1 in				Gold	Through Hole		0.62 in	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "	0.1 in	48	30 µin	30 µin	1 A	UL94 V-0	125 °C	-55 °C
3M Electronic Specialty 248-1282-29-0602J		Beryllium Copper	Beryllium Copper	Glass Filled Polysulfone PSU	Gold	Closed Frame	Solder	0.1 in				Gold	Through Hole		0.13 in	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "	0.1 in	48	30 µin	30 µin	1 A	UL94 V-0	125 °C	-55 °C
3M Electronic Specialty 248-5205-00	QFN	Beryllium Copper	Beryllium Copper	PES Polyethersulfone	Gold	Closed Frame	Solder	0.02 in	4	12	48	Gold	Through Hole	25 mOhm	0.118 in
3M Electronic Specialty 248-1282-09-0602J		Beryllium Copper	Beryllium Copper	Glass Filled Polysulfone PSU	Gold	Closed Frame	Solder	0.1 in				Gold	Through Hole		0.13 in	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "	0.1 in	48	30 µin	30 µin	1 A	UL94 V-0	125 °C	-55 °C

Pricing

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CAD

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Documents

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Datasheet