248 Series

Catalog

IC & COMPONENT SOCKET, 48 CONTACTS, QFN TEST SOCKET, 0.5 MM, 248 SERIES, BERYLLIUM COPPER

Part	Type	Contact Material - Mating	Contact Material - Post	Housing Material	Contact Finish - Post	Features	Termination	Pitch - Mating	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Finish - Mating	Mounting Type	Contact Resistance	Termination Post Length	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Convert From (Adapter End)	Convert From (Adapter End) Type	Convert From (Adapter End) Row Spacing	Pitch - Post	Number of Pins	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Current Rating	Material Flammability Rating	Operating Temperature (Max)	Operating Temperature (Min)
3M Electronic Specialty 248-5205-01	QFN	Beryllium Copper	Beryllium Copper	PES Polyethersulfone	Gold	Closed Frame	Solder	0.02 in	4	12	48	Gold	Through Hole	25 mOhm	0.118 in
3M Electronic Specialty 248-1282-19-0602J		Beryllium Copper	Beryllium Copper	Glass Filled Polysulfone PSU	Gold	Closed Frame	Wire Wrap	0.1 in				Gold	Through Hole		0.62 in	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "	0.1 in	48	30 µin	30 µin	1 A	UL94 V-0	125 °C	-55 °C
3M Electronic Specialty 248-1282-29-0602J		Beryllium Copper	Beryllium Copper	Glass Filled Polysulfone PSU	Gold	Closed Frame	Solder	0.1 in				Gold	Through Hole		0.13 in	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "	0.1 in	48	30 µin	30 µin	1 A	UL94 V-0	125 °C	-55 °C
3M Electronic Specialty 248-5205-00	QFN	Beryllium Copper	Beryllium Copper	PES Polyethersulfone	Gold	Closed Frame	Solder	0.02 in	4	12	48	Gold	Through Hole	25 mOhm	0.118 in
3M Electronic Specialty 248-1282-09-0602J		Beryllium Copper	Beryllium Copper	Glass Filled Polysulfone PSU	Gold	Closed Frame	Solder	0.1 in				Gold	Through Hole		0.13 in	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "	0.1 in	48	30 µin	30 µin	1 A	UL94 V-0	125 °C	-55 °C