PMDPB56XNEAX

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Nexperia USA Inc.

TRANS MOSFET ARRAY DUAL N-CH 30V 3.1A 6-PIN DFN2020D T/R

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PMDPB56XNEAX

Active

Nexperia USA Inc.

TRANS MOSFET ARRAY DUAL N-CH 30V 3.1A 6-PIN DFN2020D T/R

Find alt

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Description Specifications Series Pricing CAD Documents

Description

General part information

PMDPB56XNEA Series

Dual N-channel enhancement mode Field-Effect Transistor (FET) in a small and leadless DFN2020D-6 (SOT1118D) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

Technical Specifications

Parameters and characteristics for this part

Specification	PMDPB56XNEAX

Channel Count	2
Configuration	N-Channel
Configuration - Features	Dual
Current - Continuous Drain (Id) (Ta)	3.1 A
Drain to Source Voltage (Vdss)	30 V
Gate Charge (Max)	5 nC
Grade	Automotive
Input Capacitance (Ciss) (Max)	256 pF
Mounting Type	Surface Mount
Operating Temperature (Max)	150 °C
Operating Temperature (Min)	-55 °C
Package / Case	6-UDFN Exposed Pad
Package Name	DFN2020D-6
Power - Max (Ta)	485 mW
Qualification	AEC-Q100
Rds On (Max)	72 mOhm
Technology	MOSFET (Metal Oxide)
Vgs(th) (Max)	1.25 V

PMDPB56XNEA Series

30 V, dual N-channel Trench MOSFET

Part	Operating Temperature (Min)	Operating Temperature (Max)	Package / Case	Mounting Type	Power - Max (Ta)	Input Capacitance (Ciss) (Max)	Qualification	Grade	Gate Charge (Max)	Drain to Source Voltage (Vdss)	Current - Continuous Drain (Id) (Ta)	Vgs(th) (Max)	Technology	Rds On (Max)	Channel Count	Configuration	Configuration - Features	Package Name
Nexperia USA Inc. PMDPB56XNEAX	-55 °C	150 °C	6-UDFN Exposed Pad	Surface Mount	485 mW	256 pF	AEC-Q100	Automotive	5 nC	30 V	3.1 A	1.25 V	MOSFET (Metal Oxide)	72 mOhm	2	N-Channel	Dual	DFN2020D-6

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

小巧轻便的汽车二极管和晶体管

Automatic Optical Inspection of DFN Components

plastic, leadless thermally enhanced ultra thin and small outline package with side-wettable flanks (SWF); 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body

Questions about package outline drawings

Small & light automotive diodes and transistors

Nexperia package poster

Reflow soldering profile

Thermal performance of DFN packages

plastic, thermally enhanced ultra thin and small outline package; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body