Specification	SMD4300AX500T4C

Composition	Pb37, Sn63
Flux Type	Water Soluble, No-Clean
Form	Cartridge
Form Weight	17.64 oz
Melting Point	361 °F
Mesh Type	4
Process	Leaded
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature (Maximum)	46 °F
Storage/Refrigeration Temperature (Minimum)	37 °F
Type	Solder Paste

SMD4300 Series

Part	Shipping Info	Composition	Process	Form	Form Weight	Flux Type	Type	Storage/Refrigeration Temperature (Maximum)	Storage/Refrigeration Temperature (Minimum)	Mesh Type	Shelf Life Start	Melting Point	Shelf Life	Ag Composition	Composition Elements	Composition Formula	Bi Composition	Sn Composition
Chip Quik Inc. SMD4300AX500T4C	Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended.	Pb37 Sn63	Leaded	Cartridge	17.64 oz	No-Clean Water Soluble	Solder Paste	46 °F	37 °F	4	Date of Manufacture	361 °F	12 Months
Chip Quik Inc. SMD4300LTLFP250T4			Lead Free	Jar	8.8 oz	No-Clean Water Soluble	Solder Paste	77 °F	32 °F		Date of Manufacture	280 °F	6 Months	0.4 %	Ag Bi Sn	Bi57.6Sn42Ag0.4	57.6 %	42 %

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