SMD4300 Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
SOLDER PASTE 63/37 T4 500G
| Part | Shipping Info | Composition | Process | Form | Form Weight | Flux Type | Type | Storage/Refrigeration Temperature (Maximum) | Storage/Refrigeration Temperature (Minimum) | Mesh Type | Shelf Life Start | Melting Point | Shelf Life | Ag Composition | Composition Elements | Composition Formula | Bi Composition | Sn Composition |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | Pb37 Sn63 | Leaded | Cartridge | 17.64 oz | No-Clean Water Soluble | Solder Paste | 46 °F | 37 °F | 4 | Date of Manufacture | 361 °F | 12 Months | |||||
 Chip Quik Inc. | Lead Free | Jar | 8.8 oz | No-Clean Water Soluble | Solder Paste | 77 °F | 32 °F | Date of Manufacture | 280 °F | 6 Months | 0.4 % | Ag Bi Sn | Bi57.6Sn42Ag0.4 | 57.6 % | 42 % |