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IQE008N03LM5CGATMA1 - INFINEON IQE050N08NM5CGATMA1

IQE008N03LM5CGATMA1

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Infineon Technologies

IQE008N03LM5CG OPTIMOS™ LOW-VOLTAGE POWER MOSFET 30 V IN PQFN 3.3X3.3 SOURCE-DOWN PACKAGE

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IQE008N03LM5CGATMA1 - INFINEON IQE050N08NM5CGATMA1

IQE008N03LM5CGATMA1

Active
Infineon Technologies

IQE008N03LM5CG OPTIMOS™ LOW-VOLTAGE POWER MOSFET 30 V IN PQFN 3.3X3.3 SOURCE-DOWN PACKAGE

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationIQE008N03LM5CGATMA1
Current - Continuous Drain (Id) @ 25°C27 A, 253 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]64 nC
Input Capacitance (Ciss) (Max) @ Vds5700 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)89 W, 2.1 W
Rds On (Max) @ Id, Vgs0.85 mOhm
Supplier Device PackagePG-TTFN-9-1
TechnologyMOSFET (Metal Oxide)
Vgs (Max)16 V
Vgs(th) (Max) @ Id2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.70
10$ 1.82
100$ 1.25
500$ 1.03
Digi-Reel® 1$ 2.70
10$ 1.82
100$ 1.25
500$ 1.03
Tape & Reel (TR) 5000$ 0.86
NewarkEach (Supplied on Cut Tape) 1$ 2.76
10$ 1.85
25$ 1.66
50$ 1.47
100$ 1.28
250$ 1.27
500$ 1.02
1000$ 0.99

Description

General part information

IQE008N Series

The IQE008N03LM5CG is Infineon’s extension of the innovativeSource-Downtechnology. TheOptiMOSTM5 30VPQFN 3.3x3.3 Source-Down features 30 V and low RDS(on)of 0.85 mOhm. The revolutionary Source-Down technology introduces a flipped silicon die, which is positioned upside down inside of the components. This adjustment allows the source potential (instead of the drain potential) to be connected to the PCB over the thermal pad. Therefore, it offers several advantages, such as increased thermal capability, advanced power density or improved layout possibilities. Furthermore, the higher efficiency, the reduced active cooling requirements and the effective layout for thermal management are benefits at the system level. Thanks to the new benchmark RDS(on)and the innovative layout capacities enable the Source-Down concept to have a leading position in temperature management. The Source-Down portfolio is addressing applications, such asDrives,Telecom,SMPSorServer. The new technology can be found in two different footprints for now:Source-DownStandard-Gate andSource-DownCenter-Gate (optimized for parallelization).

Documents

Technical documentation and resources