10018784-10212TLF

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Amphenol ICC (FCI)

CONN PCI EXP FMALE 98POS 0.039

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10018784-10212TLF

Active

Amphenol ICC (FCI)

CONN PCI EXP FMALE 98POS 0.039

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 1.19
		10	$ 0.91
		25	$ 0.81
		40	$ 0.77
		80	$ 0.71
		230	$ 0.63
		440	$ 0.59
		945	$ 0.54
		2400	$ 0.50

Description

General part information

10018784 Series

98 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black

Documents

Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	10018784-10212TLF	10018784 Series

Card Thickness	0.062 in	0.062 - 0.093 in
Card Thickness	1.57 mm	1.57 - 2.36 mm
Card Type	PCI Express™	PCI Express™
Color	Black	Black, White
Contact Finish	Gold	GXT™, Gold or Gold, Gold
Contact Finish Thickness	Flash	Flash
Contact Finish Thickness	-	15 - 30 µin
Contact Finish Thickness	-	0.38 - 0.76 µm
Contact Material	Copper Alloy	Copper Alloy
Contact Type	Cantilever	Cantilever
Features	Locking Ramp, Board Guide	Locking Ramp, Board Guide, Board Lock
Gender	Female	Female
Material - Insulation	Polyamide (PA), Glass Filled, Nylon	Polyamide (PA), Glass Filled, Nylon
Mounting Type	Through Hole	Through Hole
Number of Positions	98	36 - 164
Number of Positions/Bay/Row	-	21
Number of Positions/Bay/Row	-	11
Number of Rows	2	2
Operating Temperature [Max]	85 °C	85 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch [x]	0.039 in	0.039 in
Pitch [x]	1 mm	1 mm
Read Out	Dual	Dual
Termination	Solder	Solder, Staggered, Solder

10018784 Series

CONN PCI EXP FML 98POS 0.039

Part	Gender	Pitch [x]	Pitch [x]	Card Thickness	Card Thickness	Termination	Mounting Type	Contact Finish Thickness	Read Out	Color	Features	Contact Material	Operating Temperature [Max]	Operating Temperature [Min]	Material - Insulation	Number of Positions	Card Type	Number of Rows	Contact Finish	Contact Finish Thickness	Contact Finish Thickness	Contact Type	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]
Amphenol ICC (FCI) 10018784-10202MLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole	Flash	Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	98	PCI Express™	2	Gold or Gold, GXT™
Amphenol ICC (FCI) 10018784-00102TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole		Dual	White	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	98	PCI Express™	2	Gold or Gold, GXT™	15 µin	0.38 µm
Amphenol ICC (FCI) 10018784-11103TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole		Dual	Black	Board Lock, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	164	PCI Express™	2	Gold	15 µin	0.38 µm	Cantilever
Amphenol ICC (FCI) 10018784-10000MLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole		Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	36	PCI Express™	2	Gold or Gold, GXT™	30 Áin	0.76 Ám
Amphenol ICC (FCI) 10018784-00100TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole		Dual	White	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	36	PCI Express™	2	Gold or Gold, GXT™	15 µin	0.38 µm
Amphenol ICC (FCI) 10018784-10213TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole	Flash	Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	164	PCI Express™	2	Gold			Cantilever
Amphenol ICC (FCI) 10018784-10201TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole	Flash	Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	64	PCI Express™	2	Gold			Cantilever	21	11
Amphenol ICC (FCI) 10018784-10112TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder	Through Hole		Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	98	PCI Express™	2	Gold	15 µin	0.38 µm	Cantilever
Amphenol ICC (FCI) 10018784-11201TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder, Staggered	Through Hole	Flash	Dual	Black	Board Lock, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	64	PCI Express™	2	Gold			Cantilever	21	11
Amphenol ICC (FCI) 10018784-10102TLF	Female	0.039 in	1 mm	0.062 in	1.57 mm	Solder	Through Hole		Dual	Black	Board Guide, Locking Ramp	Copper Alloy	85 °C	-55 °C	Glass Filled, Nylon, Polyamide (PA)	98	PCI Express™	2	Gold	15 µin	0.38 µm	Cantilever