Zenode.ai Logo

110-87-950-41-001101

Active
Preci-Dip

CONN IC DIP SOCKET 50POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

110-87-950-41-001101

Active
Preci-Dip

CONN IC DIP SOCKET 50POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification110-87-950-41-001101110-87 Series
Contact Finish - MatingGoldGold
Contact Finish - PostTinTin
Contact Finish Thickness - MatingFlashFlash
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - Post [custom]BrassBrass
Contact Resistance10 mOhm10 mOhm
Current Rating (Amps)1 A1 A
FeaturesOpen FrameOpen Frame, No Center Bar
Housing MaterialGlass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole, Surface Mount
Number of Positions or Pins (Grid)-6 - 64
Number of Positions or Pins (Grid)-3 - 20
Number of Positions or Pins (Grid)-4
Number of Positions or Pins (Grid)-2 x 5, 2 x 16
Number of Positions or Pins (Grid)-10
Number of Positions or Pins (Grid)-32
Number of Positions or Pins (Grid) [custom]2525
Number of Positions or Pins (Grid) [custom]22
Number of Positions or Pins (Grid) [custom]506 - 50
Operating Temperature [Max]125 °C125 °C
Operating Temperature [Min]-55 °C-55 °C
Pitch - Mating0.1 in0.1 in
Pitch - Mating2.54 mm2.54 mm
Pitch - Post2.54 mm2.54 mm
Pitch - Post0.1 in0.1 in
TerminationSolderSolder
Termination Post Length3.18 mm3 - 3.18 mm
Termination Post Length0.125 in0.118 - 0.125 in
Type22.86 mm5.08 - 22.86 mm
TypeDIPDIP
Type0.9 in0.2 - 0.9 in

110-87 Series

22P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

PartPitch - PostPitch - PostContact ResistanceHousing MaterialContact Finish Thickness - MatingMaterial Flammability RatingTypeTypeTypeContact Finish - PostContact Material - MatingOperating Temperature [Min]Operating Temperature [Max]Current Rating (Amps)TerminationPitch - MatingPitch - MatingMounting TypeContact Finish - MatingTermination Post LengthTermination Post LengthFeaturesContact Material - Post [custom]Number of Positions or Pins (Grid)Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
0.4 in
10.16 mm
DIP
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Through Hole
Gold
3.18 mm
0.125 in
Open Frame
Brass
22
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
0.9 in
22.86 mm
DIP
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Through Hole
Gold
3.18 mm
0.125 in
Open Frame
Brass
25
2
50
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
0.6 in
15.24 mm
DIP
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Through Hole
Gold
Open Frame
Brass
40
2
20
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
0.3 "
7.62 mm
DIP
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Through Hole
Gold
Open Frame
Brass
14
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Through Hole
Gold
Open Frame
Brass
64
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
0.3 "
7.62 mm
DIP
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Surface Mount
Gold
3 mm
0.118 in
Open Frame
Brass
22
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
0.4 in
10.16 mm
DIP
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Through Hole
Gold
Open Frame
Brass
24
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
0.6 in
15.24 mm
DIP
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Surface Mount
Gold
3 mm
0.118 in
Open Frame
Brass
28
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
0.6 in
15.24 mm
DIP
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Surface Mount
Gold
3 mm
0.118 in
Open Frame
Brass
42
2.54 mm
0.1 in
10 mOhm
Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Flash
UL94 V-0
0.3 "
7.62 mm
DIP
Tin
Beryllium Copper
-55 °C
125 °C
1 A
Solder
0.1 in
2.54 mm
Through Hole
Gold
3.18 mm
0.125 in
Open Frame
Brass
28

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 400$ 2.64

Description

General part information

110-87 Series

50 (2 x 25) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources