110-87-950-41-001101

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Preci-Dip

CONN IC DIP SOCKET 50POS GOLD

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DocumentsDIL/SIL/TO Socket Catalog

110-87-950-41-001101

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Preci-Dip

CONN IC DIP SOCKET 50POS GOLD

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DocumentsDIL/SIL/TO Socket Catalog

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	400	$ 2.64

Description

General part information

110-87 Series

50 (2 x 25) Pos DIP, 0.9" (22.86mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources

DIL/SIL/TO Socket Catalog

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	110-87-950-41-001101	110-87 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Tin	Tin
Contact Finish Thickness - Mating	Flash	Flash
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	10 mOhm	10 mOhm
Current Rating (Amps)	1 A	1 A
Features	Open Frame	Open Frame, No Center Bar
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Surface Mount
Number of Positions or Pins (Grid)	-	6 - 64
Number of Positions or Pins (Grid)	-	3 - 20
Number of Positions or Pins (Grid)	-	4
Number of Positions or Pins (Grid)	-	2 x 5, 2 x 16
Number of Positions or Pins (Grid)	-	10
Number of Positions or Pins (Grid)	-	32
Number of Positions or Pins (Grid) [custom]	25	25
Number of Positions or Pins (Grid) [custom]	2	2
Number of Positions or Pins (Grid) [custom]	50	6 - 50
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	3.18 mm	3 - 3.18 mm
Termination Post Length	0.125 in	0.118 - 0.125 in
Type	22.86 mm	5.08 - 22.86 mm
Type	DIP	DIP
Type	0.9 in	0.2 - 0.9 in

110-87 Series

22P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Pitch - Post	Pitch - Post	Contact Resistance	Housing Material	Contact Finish Thickness - Mating	Material Flammability Rating	Type	Type	Type	Contact Finish - Post	Contact Material - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Termination	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Finish - Mating	Termination Post Length	Termination Post Length	Features	Contact Material - Post [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Preci-Dip 110-87-422-41-605101	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0	0.4 in	10.16 mm	DIP	Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Through Hole	Gold	3.18 mm	0.125 in	Open Frame	Brass	22
Preci-Dip 110-87-950-41-001101	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0	0.9 in	22.86 mm	DIP	Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Through Hole	Gold	3.18 mm	0.125 in	Open Frame	Brass		25	2	50
Preci-Dip 110-87-640-41-005101	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0	0.6 in	15.24 mm	DIP	Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Through Hole	Gold			Open Frame	Brass	40		2		20
Preci-Dip 110-87-314-41-005101	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0	0.3 "	7.62 mm	DIP	Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Through Hole	Gold			Open Frame	Brass	14
Preci-Dip 110-87-064-01-505101	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0				Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Through Hole	Gold			Open Frame	Brass	64
Preci-Dip 110-87-322-41-105101	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0	0.3 "	7.62 mm	DIP	Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Surface Mount	Gold	3 mm	0.118 in	Open Frame	Brass	22
Preci-Dip 110-87-424-41-005101	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0	0.4 in	10.16 mm	DIP	Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Through Hole	Gold			Open Frame	Brass	24
Preci-Dip 110-87-628-41-105191	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0	0.6 in	15.24 mm	DIP	Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Surface Mount	Gold	3 mm	0.118 in	Open Frame	Brass	28
Preci-Dip 110-87-642-41-105161	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0	0.6 in	15.24 mm	DIP	Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Surface Mount	Gold	3 mm	0.118 in	Open Frame	Brass	42
Preci-Dip 110-87-328-41-001101	2.54 mm	0.1 in	10 mOhm	Glass Filled, Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	Flash	UL94 V-0	0.3 "	7.62 mm	DIP	Tin	Beryllium Copper	-55 °C	125 °C	1 A	Solder	0.1 in	2.54 mm	Through Hole	Gold	3.18 mm	0.125 in	Open Frame	Brass	28