MCZ33905 Series

Part	Package Width	Package Features	Package Name	Package Length	Applications	Interface	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Mounting Type	Grade	Operating Temperature (Max)	Operating Temperature (Min)	Current - Supply
NXP USA Inc. MCZ33905DS5EKR2	7.5 mm	Exposed Pad	32-SOIC-EP 32-SSOP	0.295 in	System Basis Chip	CAN LIN	28 V	5.5 V	Surface Mount
NXP USA Inc. MCZ33905DD5EK	7.5 mm	Exposed Pad	54-SOIC-EP 54-SSOP	0.295 in	System Basis Chip				Surface Mount
NXP USA Inc. MCZ33905DS5EK	7.5 mm	Exposed Pad	32-SOIC-EP 32-SSOP	0.295 in	System Basis Chip	CAN LIN	28 V	5.5 V	Surface Mount
NXP USA Inc. MCZ33905BS5EKR2	7.5 mm	Exposed Pad	32-SOIC-EP 32-SSOP	0.295 in	System Basis Chip				Surface Mount
NXP USA Inc. MCZ33905DD5EKR2	7.5 mm	Exposed Pad	54-SOIC-EP 54-SSOP	0.295 in	System Basis Chip	CAN LIN	28 V	5.5 V	Surface Mount
NXP USA Inc. MCZ33905DD5EK	7.5 mm	Exposed Pad	54-SOIC-EP 54-SSOP	0.295 in	System Basis Chip				Surface Mount	Automotive
NXP USA Inc. MCZ33905BS5EKR2	7.5 mm	Exposed Pad	32-HSOP 32-SSOP	0.295 in	System Basis Chip		28 V	5.5 V	Surface Mount	Automotive	125 °C	-40 °C	2.8 mA

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