MCZ33905 Series
Manufacturer: NXP USA Inc.
SYSTEM BASIS CHIP, CAN, LIN, ISO 11898-2/5, 5V OUTPUT, 5.5 TO 28V SUPPLY, WSOIC-EP-32
| Part | Package Width | Package Features | Package Name | Package Length | Applications | Interface | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Mounting Type | Grade | Operating Temperature (Max) | Operating Temperature (Min) | Current - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | 7.5 mm | Exposed Pad | 32-SOIC-EP 32-SSOP | 0.295 in | System Basis Chip | CAN LIN | 28 V | 5.5 V | Surface Mount | ||||
NXP USA Inc. | 7.5 mm | Exposed Pad | 54-SOIC-EP 54-SSOP | 0.295 in | System Basis Chip | Surface Mount | |||||||
NXP USA Inc. | 7.5 mm | Exposed Pad | 32-SOIC-EP 32-SSOP | 0.295 in | System Basis Chip | CAN LIN | 28 V | 5.5 V | Surface Mount | ||||
NXP USA Inc. | 7.5 mm | Exposed Pad | 32-SOIC-EP 32-SSOP | 0.295 in | System Basis Chip | Surface Mount | |||||||
NXP USA Inc. | 7.5 mm | Exposed Pad | 54-SOIC-EP 54-SSOP | 0.295 in | System Basis Chip | CAN LIN | 28 V | 5.5 V | Surface Mount | ||||
NXP USA Inc. | 7.5 mm | Exposed Pad | 54-SOIC-EP 54-SSOP | 0.295 in | System Basis Chip | Surface Mount | Automotive | ||||||
NXP USA Inc. | 7.5 mm | Exposed Pad | 32-HSOP 32-SSOP | 0.295 in | System Basis Chip | 28 V | 5.5 V | Surface Mount | Automotive | 125 °C | -40 °C | 2.8 mA |