
PMV50UPE,215
ActiveNexperia USA Inc.
20 V, SINGLE P-CHANNEL TRENCH MOSFET

PMV50UPE,215
ActiveNexperia USA Inc.
20 V, SINGLE P-CHANNEL TRENCH MOSFET
Description
General part information
PMV50UPE Series
P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMV50UPE,215 |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 3.2 A |
| Drain to Source Voltage (Vdss) | 20 V |
| Drive Voltage (Max Rds On) | 1.8 V |
| Drive Voltage (Min Rds On) | 4.5 V |
| FET Type | P-Channel |
| Gate Charge (Max) | 15.7 nC |
| Input Capacitance (Ciss) (Max) | 24 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | TO-236-3, SOT-23-3, SC-59 |
| Package Name | TO-236AB |
| Power Dissipation (Max) | 500 mW |
| Rds On (Max) | 66 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 8 V |
| Vgs(th) (Max) | 900 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Power MOSFET frequently asked questions and answers
Failure signature of Electrical Overstress on Power MOSFETs
LFPAK MOSFET thermal design guide - Part 2
Reel pack for SMD, 11"; Q3/T4 product orientation
Questions about package outline drawings
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body
LFPAK MOSFET thermal design guide, Chinese version
Using power MOSFETs in parallel
RC Thermal Models
Wave soldering profile
Nexperia package poster
Power MOSFET single-shot and repetitive avalanche ruggedness rating
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body
Reflow soldering profile
Reel pack for SMD, 7"; Q3/T4 product orientation