IPT111N20NFDATMA1

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Infineon Technologies

OPTIMOS™ 3 N-CHANNEL POWER MOSFET 200 V ; TOLL HSOF-8 PACKAGE; 11.1 MOHM; FAST DIODE

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IPT111N20NFDATMA1

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Infineon Technologies

OPTIMOS™ 3 N-CHANNEL POWER MOSFET 200 V ; TOLL HSOF-8 PACKAGE; 11.1 MOHM; FAST DIODE

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	IPT111N20NFDATMA1

Current - Continuous Drain (Id) @ 25°C	96 A
Drain to Source Voltage (Vdss)	200 V
Drive Voltage (Max Rds On, Min Rds On)	10 V
FET Type	N-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]	87 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]	7000 pF
Mounting Type	Surface Mount
Operating Temperature [Max]	175 ░C
Operating Temperature [Min]	-55 °C
Package / Case	8-PowerSFN
Power Dissipation (Max) [Max]	375 W
Rds On (Max) @ Id, Vgs	11.1 mOhm
Supplier Device Package	PG-HSOF-8-1
Technology	MOSFET (Metal Oxide)
Vgs (Max)	20 V
Vgs(th) (Max) @ Id	4 V

IPT111 Series

Part	Technology	Drive Voltage (Max Rds On, Min Rds On)	Input Capacitance (Ciss) (Max) @ Vds [Max]	Operating Temperature [Min]	Operating Temperature [Max]	Drain to Source Voltage (Vdss)	FET Type	Power Dissipation (Max) [Max]	Supplier Device Package	Current - Continuous Drain (Id) @ 25°C	Vgs (Max)	Gate Charge (Qg) (Max) @ Vgs [Max]	Vgs(th) (Max) @ Id	Mounting Type	Package / Case	Rds On (Max) @ Id, Vgs
Infineon Technologies IPT111N20NFDATMA1	MOSFET (Metal Oxide)	10 V	7000 pF	-55 °C	175 ░C	200 V	N-Channel	375 W	PG-HSOF-8-1	96 A	20 V	87 nC	4 V	Surface Mount	8-PowerSFN	11.1 mOhm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 8.66
		10	$ 5.92
		100	$ 4.37
		500	$ 3.93
	Digi-Reel®	1	$ 8.66
		10	$ 5.92
		100	$ 4.37
		500	$ 3.93
	Tape & Reel (TR)	2000	$ 3.93
Newark	Each (Supplied on Full Reel)	2000	$ 3.85

Description

General part information

IPT111 Series

Infineon's TO-Leadless package is optimized for high current applications such as forklift, light electric vehicles (LEV), POL (point-of-load) and telecom. This package is a perfect solution for high power applications where highest efficiency, outstanding EMI behaviour as well as best thermal behaviour and space reduction are required.

Documents

Technical documentation and resources