
PMXB350UPEZ
ActiveNexperia USA Inc.
POWER MOSFET, P CHANNEL, 20 V, 1.2 A, 0.35 OHM, DFN1010D, SURFACE MOUNT

PMXB350UPEZ
ActiveNexperia USA Inc.
POWER MOSFET, P CHANNEL, 20 V, 1.2 A, 0.35 OHM, DFN1010D, SURFACE MOUNT
Description
General part information
PMXB350 Series
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMXB350UPEZ |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 1.2 A |
| Drain to Source Voltage (Vdss) | 20 V |
| FET Type | P-Channel |
| Gate Charge (Max) | 2.3 nC |
| Input Capacitance (Ciss) (Max) | 116 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 3-XDFN Exposed Pad |
| Package Name | DFN1010D-3 |
| Power Dissipation (Max) | 5.68 W, 360 mW |
| Rds On (Max) | 447 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 8 V |
| Vgs(th) (Max) | 950 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Questions about package outline drawings
DFN1010D-3; Reel pack, SMD, 7"; Q2/T3 standard product orientation; Orderable part number ending ,147 or Z; Ordering code (12NC) ending 147
Reflow soldering profile
Power MOSFET single-shot and repetitive avalanche ruggedness rating
plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body
Using power MOSFETs in parallel
RC Thermal Models
LFPAK MOSFET thermal design guide, Chinese version
plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body
LFPAK MOSFET thermal design guide - Part 2
Nexperia package poster
Power MOSFET frequently asked questions and answers
Thermal performance of DFN packages