HTSW-208-14-G-S
ActiveSamtec Inc.
CONN HEADER VERT 8POS 5.08MM
Deep-Dive with AI
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HTSW-208-14-G-S
ActiveSamtec Inc.
CONN HEADER VERT 8POS 5.08MM
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | HTSW-208-14-G-S |
|---|---|
| Connector Type | Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 3 µin |
| Contact Finish Thickness - Post | 0.076 µm |
| Contact Length - Mating | 8.13 mm |
| Contact Length - Mating | 0.32 in |
| Contact Length - Post | 2.79 mm |
| Contact Length - Post [x] | 0.11 in |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Current Rating (Amps) | Varies by Wire Gauge |
| Fastening Type | Push-Pull |
| Insulation Color | Natural |
| Insulation Height | 0.1 in |
| Insulation Height | 2.54 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions | 8 |
| Number of Positions Loaded | All |
| Number of Rows | 1 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Overall Contact Length | 13.46 mm |
| Overall Contact Length | 0.53 in |
| Pitch - Mating | 5.08 mm |
| Pitch - Mating | 0.2 in |
| Shrouding | Unshrouded |
| Style | Board to Board, Cable |
| Termination | Solder |
HTSW-208 Series
| Part | Style | Overall Contact Length | Overall Contact Length | Contact Length - Post [x] | Contact Length - Post | Contact Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Current Rating (Amps) | Number of Rows | Termination | Mounting Type | Connector Type | Material Flammability Rating | Insulation Height | Insulation Height | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Material | Shrouding | Number of Positions | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Mating | Contact Length - Mating | Fastening Type | Contact Material | Contact Shape | Contact Finish - Post | Insulation Color | Pitch - Mating | Pitch - Mating | Number of Positions Loaded | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Length - Mating [x] | Number of Positions | Contact Length - Post [x] | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | ||||||||||||||||||||||||||||||||||||||||
Samtec Inc. | Board to Board Cable | 13.46 mm | 0.53 in | 0.11 in | 2.79 mm | Male Pin | 10 çin | 0.25 çm | Gold | Varies by Wire Gauge | 1 | Solder | Through Hole | Header | UL94 V-0 | 0.1 in | 2.54 mm | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Unshrouded | 8 | 3 µin | 0.076 µm | 8.13 mm | 0.32 in | Push-Pull | Phosphor Bronze | Square | Gold | Natural | 5.08 mm | 0.2 in | All | ||||||
Samtec Inc. | Board to Board Cable | 13.46 mm | 0.53 in | 0.11 in | 2.79 mm | Male Pin | Varies by Wire Gauge | 1 | Solder | Through Hole | Header | UL94 V-0 | 0.1 in | 2.54 mm | -55 °C | 105 ░C | Liquid Crystal Polymer (LCP) | Unshrouded | 8 | 8.13 mm | 0.32 in | Push-Pull | Phosphor Bronze | Square | Tin | Natural | 5.08 mm | 0.2 in | All | |||||||||||
Samtec Inc. | Board to Board Cable | 13.46 mm | 0.53 in | 0.2 in | Male Pin | 10 çin | 0.25 çm | Gold | Varies by Wire Gauge | 2 | Solder | Through Hole | Header | UL94 V-0 | 0.1 in | 2.54 mm | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Unshrouded | 5.84 mm | Push-Pull | Phosphor Bronze | Square | Tin | Natural | 5.08 mm | 0.2 in | All | 2.54 mm | 0.1 in | 0.23 in | 16 | 5.08 mm | ||||||
Samtec Inc. | Board to Board Cable | 2.54 mm | Male Pin | 10 çin | 0.25 çm | Gold | Varies by Wire Gauge | 1 | Solder | Through Hole Right Angle | Header | UL94 V-0 | 0.122 in | 3.1 mm | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Unshrouded | 8 | 3 µin | 0.076 µm | 8.13 mm | 0.32 in | Push-Pull | Phosphor Bronze | Square | Gold | Natural | 5.08 mm | 0.2 in | All | 0.1 in | ||||||||
Samtec Inc. | Board to Board Cable | 13.46 mm | 0.53 in | 0.2 in | Male Pin | Varies by Wire Gauge | 1 | Solder | Through Hole | Header | UL94 V-0 | 0.1 in | 2.54 mm | -55 °C | 105 ░C | Liquid Crystal Polymer (LCP) | Unshrouded | 8 | 5.84 mm | Push-Pull | Phosphor Bronze | Square | Tin | Natural | 5.08 mm | 0.2 in | All | 0.23 in | 5.08 mm | |||||||||||
Samtec Inc. | Board to Board Cable | 15.24 mm | Male Pin | Varies by Wire Gauge | 1 | Solder | Through Hole Right Angle | Header | UL94 V-0 | 0.122 in | 3.1 mm | -55 °C | 105 ░C | Liquid Crystal Polymer (LCP) | Unshrouded | 8 | 8.13 mm | 0.32 in | Push-Pull | Phosphor Bronze | Square | Tin | Natural | 5.08 mm | 0.2 in | All | 0.6 in | |||||||||||||
Samtec Inc. | Board to Board Cable | 2.76 mm | Male Pin | 10 çin | 0.25 çm | Gold | Varies by Wire Gauge | 1 | Solder | Through Hole Right Angle | Header | UL94 V-0 | 0.122 in | 3.1 mm | -55 °C | 125 °C | Liquid Crystal Polymer (LCP) | Unshrouded | 8 | 3 µin | 0.076 µm | 5.84 mm | Push-Pull | Phosphor Bronze | Square | Gold | Natural | 5.08 mm | 0.2 in | All | 0.23 in | 0.109 in | ||||||||
Samtec Inc. | Board to Board Cable | 2.54 mm | Male Pin | Varies by Wire Gauge | 1 | Solder | Through Hole Right Angle | Header | UL94 V-0 | 0.122 in | 3.1 mm | -55 °C | 105 ░C | Liquid Crystal Polymer (LCP) | Unshrouded | 8 | 8.13 mm | 0.32 in | Push-Pull | Phosphor Bronze | Square | Tin | Natural | 5.08 mm | 0.2 in | All | 0.1 in |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 2.33 | |
Description
General part information
HTSW-208 Series
Connector Header Through Hole 8 position 0.200" (5.08mm)
Documents
Technical documentation and resources
No documents available