HTSW-208 Series

Catalog

CONN HEADER VERT 8POS 5.08MM

Part	Style	Overall Contact Length	Overall Contact Length	Contact Length - Post [x]	Contact Length - Post	Contact Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Current Rating (Amps)	Number of Rows	Termination	Mounting Type	Connector Type	Material Flammability Rating	Insulation Height	Insulation Height	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Material	Shrouding	Number of Positions	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Mating	Contact Length - Mating	Fastening Type	Contact Material	Contact Shape	Contact Finish - Post	Insulation Color	Pitch - Mating	Pitch - Mating	Number of Positions Loaded	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Length - Mating [x]	Number of Positions	Contact Length - Post [x]	Contact Length - Post
Samtec Inc. HTSW-208-05-S-S
Samtec Inc. HTSW-208-14-G-S	Board to Board Cable	13.46 mm	0.53 in	0.11 in	2.79 mm	Male Pin	10 çin	0.25 çm	Gold	Varies by Wire Gauge	1	Solder	Through Hole	Header	UL94 V-0	0.1 in	2.54 mm	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Unshrouded	8	3 µin	0.076 µm	8.13 mm	0.32 in	Push-Pull	Phosphor Bronze	Square	Gold	Natural	5.08 mm	0.2 in	All
Samtec Inc. HTSW-208-14-T-S	Board to Board Cable	13.46 mm	0.53 in	0.11 in	2.79 mm	Male Pin				Varies by Wire Gauge	1	Solder	Through Hole	Header	UL94 V-0	0.1 in	2.54 mm	-55 °C	105 ░C	Liquid Crystal Polymer (LCP)	Unshrouded	8			8.13 mm	0.32 in	Push-Pull	Phosphor Bronze	Square	Tin	Natural	5.08 mm	0.2 in	All
Samtec Inc. HTSW-208-08-L-D	Board to Board Cable	13.46 mm	0.53 in	0.2 in		Male Pin	10 çin	0.25 çm	Gold	Varies by Wire Gauge	2	Solder	Through Hole	Header	UL94 V-0	0.1 in	2.54 mm	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Unshrouded				5.84 mm		Push-Pull	Phosphor Bronze	Square	Tin	Natural	5.08 mm	0.2 in	All	2.54 mm	0.1 in	0.23 in	16	5.08 mm
Samtec Inc. HTSW-208-25-G-S-RA	Board to Board Cable				2.54 mm	Male Pin	10 çin	0.25 çm	Gold	Varies by Wire Gauge	1	Solder	Through Hole Right Angle	Header	UL94 V-0	0.122 in	3.1 mm	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Unshrouded	8	3 µin	0.076 µm	8.13 mm	0.32 in	Push-Pull	Phosphor Bronze	Square	Gold	Natural	5.08 mm	0.2 in	All						0.1 in
Samtec Inc. HTSW-208-08-T-S	Board to Board Cable	13.46 mm	0.53 in	0.2 in		Male Pin				Varies by Wire Gauge	1	Solder	Through Hole	Header	UL94 V-0	0.1 in	2.54 mm	-55 °C	105 ░C	Liquid Crystal Polymer (LCP)	Unshrouded	8			5.84 mm		Push-Pull	Phosphor Bronze	Square	Tin	Natural	5.08 mm	0.2 in	All			0.23 in		5.08 mm
Samtec Inc. HTSW-208-30-T-S-RA	Board to Board Cable				15.24 mm	Male Pin				Varies by Wire Gauge	1	Solder	Through Hole Right Angle	Header	UL94 V-0	0.122 in	3.1 mm	-55 °C	105 ░C	Liquid Crystal Polymer (LCP)	Unshrouded	8			8.13 mm	0.32 in	Push-Pull	Phosphor Bronze	Square	Tin	Natural	5.08 mm	0.2 in	All						0.6 in
Samtec Inc. HTSW-208-08-G-S-NA	Board to Board Cable				2.76 mm	Male Pin	10 çin	0.25 çm	Gold	Varies by Wire Gauge	1	Solder	Through Hole Right Angle	Header	UL94 V-0	0.122 in	3.1 mm	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Unshrouded	8	3 µin	0.076 µm	5.84 mm		Push-Pull	Phosphor Bronze	Square	Gold	Natural	5.08 mm	0.2 in	All			0.23 in			0.109 in
Samtec Inc. HTSW-208-25-T-S-RA	Board to Board Cable				2.54 mm	Male Pin				Varies by Wire Gauge	1	Solder	Through Hole Right Angle	Header	UL94 V-0	0.122 in	3.1 mm	-55 °C	105 ░C	Liquid Crystal Polymer (LCP)	Unshrouded	8			8.13 mm	0.32 in	Push-Pull	Phosphor Bronze	Square	Tin	Natural	5.08 mm	0.2 in	All						0.1 in