XR2C1011N

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Omron Electronics Inc-EMC Div

CONN SOCKET SIP 10POS GOLD

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XR2C1011N

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Omron Electronics Inc-EMC Div

CONN SOCKET SIP 10POS GOLD

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DocumentsHow to Read Date Codes Datasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	XR2C1011N	XR2C Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	10 çin	10 - 30 çin
Contact Finish Thickness - Mating	0.25 çm	0.25 - 0.76 çm
Contact Finish Thickness - Post	10 çin	10 - 30 çin
Contact Finish Thickness - Post	0.25 çm	0.25 - 0.76 çm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	-	Beryllium Copper
Contact Material - Post [custom]	Brass	Brass
Contact Resistance	20 mOhm	20 mOhm
Current Rating (Amps)	1 A	1 A
Features	-	Closed Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Threaded	Through Hole, Threaded
Number of Positions or Pins (Grid)	10	3 - 15
Number of Positions or Pins (Grid)	-	1 x 32
Number of Positions or Pins (Grid)	-	32
Operating Temperature [Max]	125 °C	125 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.1 in
Pitch - Mating	2.54 mm	2.54 mm
Pitch - Post	2.54 mm	2.54 mm
Pitch - Post	0.1 in	0.1 in
Termination	Solder	Solder
Termination Post Length	-	3.2 mm
Termination Post Length	-	0.126 in
Termination Post Length [x]	0.138 in	0.138 in
Termination Post Length [x]	3.5 mm	3.5 mm
Type	SIP	SIP

XR2C Series

CONN SOCKET SIP 3POS GOLD

Part	Housing Material	Contact Finish - Post	Contact Material - Mating	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid)	Mounting Type	Contact Material - Post	Termination	Contact Resistance	Pitch - Mating	Pitch - Mating	Features	Termination Post Length	Termination Post Length	Material Flammability Rating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]	Termination Post Length [x]	Termination Post Length [x]
Omron Electronics Inc-EMC Div XR2C-0311-N	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C	3	Through Hole	Beryllium Copper	Solder	20 mOhm	0.1 in	2.54 mm	Closed Frame	3.2 mm	0.126 in	UL94 V-0	2.54 mm	0.1 in	10 çin	0.25 çm	10 çin	0.25 çm	SIP	Gold
Omron Electronics Inc-EMC Div XR2C-1511-N	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C	15	Through Hole	Beryllium Copper	Solder	20 mOhm	0.1 in	2.54 mm	Closed Frame	3.2 mm	0.126 in	UL94 V-0	2.54 mm	0.1 in	10 çin	0.25 çm	10 çin	0.25 çm	SIP	Gold
Omron Electronics Inc-EMC Div XR2C-3215	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C		Threaded		Solder	20 mOhm	0.1 in	2.54 mm				UL94 V-0	2.54 mm	0.1 in	10 çin	0.25 çm	10 çin	0.25 çm	SIP	Gold	1 x 32	32	Brass
Omron Electronics Inc-EMC Div XR2C1011N	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C	10	Threaded		Solder	20 mOhm	0.1 in	2.54 mm				UL94 V-0	2.54 mm	0.1 in	10 çin	0.25 çm	10 çin	0.25 çm	SIP	Gold			Brass	0.138 in	3.5 mm
Omron Electronics Inc-EMC Div XR2C-3205	Polybutylene Terephthalate (PBT), Glass Filled	Gold	Beryllium Copper	1 A	-55 °C	125 °C		Through Hole	Beryllium Copper	Solder	20 mOhm	0.1 in	2.54 mm	Closed Frame			UL94 V-0	2.54 mm	0.1 in	30 µin	0.76 µm	30 Áin	0.76 Ám	SIP	Gold	1 x 32	32

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 2.30
		10	$ 2.00
		400	$ 1.62
		1200	$ 1.28
		5200	$ 1.13