
TLW-132-06-G-D
ActiveSamtec Inc.
CONN UNSHROUDED HEADER HDR 64 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK
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TLW-132-06-G-D
ActiveSamtec Inc.
CONN UNSHROUDED HEADER HDR 64 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK
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Technical Specifications
Parameters and characteristics for this part
| Specification | TLW-132-06-G-D |
|---|---|
| Connector Type | Header |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | Flash |
| Contact Length - Post [x] | 0.135 in |
| Contact Length - Post [x] | 3.43 mm |
| Contact Material | Phosphor Bronze |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Current Rating (Amps) | 5.2 A |
| Fastening Type | Push-Pull |
| Insulation Color | Black |
| Insulation Height [z] | 0.06 in |
| Insulation Height [z] | 1.52 mm |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Mounting Type | Through Hole |
| Number of Positions | 64 |
| Number of Positions Loaded | All |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Overall Contact Length | 7.62 mm |
| Overall Contact Length | 0.3 in |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Row Spacing - Mating [x] | 2.54 mm |
| Row Spacing - Mating [x] | 0.1 in |
| Shrouding | Unshrouded |
| Style | Board to Board, Cable |
| Termination | Solder |
TLW-132 Series
| Part | Insulation Color | Mounting Type | Contact Length - Post [x] | Contact Length - Post [x] | Connector Type | Contact Finish - Post | Contact Finish Thickness - Post | Termination | Current Rating (Amps) | Overall Contact Length | Overall Contact Length | Style | Shrouding | Pitch - Mating | Pitch - Mating | Contact Type | Fastening Type | Number of Rows | Insulation Height [z] | Insulation Height [z] | Contact Material | Operating Temperature [Min] | Operating Temperature [Max] | Contact Shape | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Insulation Material | Contact Finish - Mating | Number of Positions Loaded | Contact Length - Post | Contact Length - Post | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Number of Positions | Contact Length - Mating [x] | Contact Length - Mating | Insulation Height | Insulation Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Black | Through Hole | 0.135 in | 3.43 mm | Header | Gold | Flash | Solder | 5.2 A | 7.62 mm | 0.3 in | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 1 | 0.06 in | 1.52 mm | Phosphor Bronze | -55 °C | 125 °C | Square | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Gold | All | |||||||||
Samtec Inc. | Black | Through Hole | Header | Tin | Solder | 5.2 A | 8.51 mm | 0.335 in | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 1 | 0.06 in | 1.52 mm | Phosphor Bronze | -55 °C | 105 ░C | Square | Liquid Crystal Polymer (LCP) | All | 4.32 mm | 0.17 in | |||||||||||||
Samtec Inc. | Black | Through Hole | 0.135 in | 3.43 mm | Header | Solder | 5.2 A | 7.62 mm | 0.3 in | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 2 | 0.06 in | 1.52 mm | Phosphor Bronze | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Gold | All | 2.54 mm | 0.1 in | 64 | ||||||||||
Samtec Inc. | Black | Through Hole Right Angle | 0.12 in | 3.05 mm | Header | Gold | Flash | Solder | 5.2 A | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 2 | Phosphor Bronze | -55 °C | 125 °C | Square | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Gold | All | 2.54 mm | 0.1 in | 64 | 0.23 in | 5.84 mm | 0.197 in | 5 mm | ||||||
Samtec Inc. | Black | Through Hole | Header | Gold | Flash | Solder | 5.2 A | 8.51 mm | 0.335 in | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 2 | 0.06 in | 1.52 mm | Phosphor Bronze | -55 °C | 125 °C | Square | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Gold | All | 4.32 mm | 0.17 in | 2.54 mm | 0.1 in | 64 | ||||||
Samtec Inc. | Black | Through Hole | 0.135 in | 3.43 mm | Header | Solder | 5.2 A | 7.62 mm | 0.3 in | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 1 | 0.06 in | 1.52 mm | Phosphor Bronze | -55 °C | 125 °C | Square | Liquid Crystal Polymer (LCP) | Gold | All | |||||||||||||
Samtec Inc. | Black | Through Hole | 0.135 in | 3.43 mm | Header | Tin | Solder | 5.2 A | 7.62 mm | 0.3 in | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 2 | 0.06 in | 1.52 mm | Phosphor Bronze | -55 °C | 105 ░C | Square | Liquid Crystal Polymer (LCP) | All | 2.54 mm | 0.1 in | 64 | ||||||||||
Samtec Inc. | Black | Through Hole Right Angle | 0.12 in | 3.05 mm | Header | Gold | Flash | Solder | 5.2 A | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 1 | 0.098 in | 2.5 mm | Phosphor Bronze | -55 °C | 125 °C | Square | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Gold | All | 0.23 in | 5.84 mm | |||||||||
Samtec Inc. | Black | Through Hole | Header | Gold | Flash | Solder | 5.2 A | 8.51 mm | 0.335 in | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 1 | 0.06 in | 1.52 mm | Phosphor Bronze | -55 °C | 125 °C | Square | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Gold | All | 4.32 mm | 0.17 in | |||||||||
Samtec Inc. | Black | Through Hole | 0.135 in | 3.43 mm | Header | Gold | Flash | Solder | 5.2 A | 7.62 mm | 0.3 in | Board to Board Cable | Unshrouded | 0.1 in | 2.54 mm | Male Pin | Push-Pull | 2 | 0.06 in | 1.52 mm | Phosphor Bronze | -55 °C | 125 °C | Square | 10 çin | 0.25 çm | Liquid Crystal Polymer (LCP) | Gold | All | 2.54 mm | 0.1 in | 64 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
TLW-132 Series
Connector Header Through Hole 64 position 0.100" (2.54mm)
Documents
Technical documentation and resources