TLW-132 Series

Catalog

LOW PROFILE .025 SQ STRIPS

Part	Number of Rows	Fastening Type	Contact Finish Thickness - Mating	Number of Positions Loaded	Contact Shape	Insulation Height	Contact Length - Mating	Number of Positions	Overall Contact Length	Contact Material	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Insulation Color	Contact Finish - Post	Contact Length - Post	Insulation Material	Connector Type	Contact Finish - Mating	Contact Type	Mounting Type	Shrouding	Style	Pitch - Mating	Current Rating (Per Contact)	Row Spacing - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post (string_set)
Samtec Inc. TLW-132-06-F-S	1	Push-Pull	3 µin	All	Square	0.06 in	0.105 in	32	0.3 in	Phosphor Bronze	125 °C	-55 °C	Solder	Black	Tin	0.135 in	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A
Samtec Inc. TLW-132-05-T-S	1	Push-Pull		All	Square	0.06 in	0.105 in	32	0.335 in	Phosphor Bronze	105 °C	-55 °C	Solder	Black	Tin	0.17 in	Liquid Crystal Polymer (LCP)	Header	Tin	Male Pin	Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A
Samtec Inc. TLW-132-06-L-D	2	Push-Pull		All	Square	0.06 in	0.105 in	64	0.3 in	Phosphor Bronze	125 °C	-55 °C	Solder	Black		0.135 in	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A	0.1 in
Samtec Inc. TLW-132-01-G-D-RA	2	Push-Pull	10 µin	All	Square	0.197 in	0.23 in	64		Phosphor Bronze	125 °C	-55 °C	Solder	Black	Gold	0.12 in	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Right Angle Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A	0.1 in	Flash	Flash
Samtec Inc. TLW-132-06-H-S	1	Push-Pull		All	Square	0.06 in	0.105 in	32	0.3 in	Phosphor Bronze	125 °C	-55 °C	Solder	Black		0.135 in	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A
Samtec Inc. TLW-132-06-T-D	2	Push-Pull		All	Square	0.06 in	0.105 in	64	0.3 in	Phosphor Bronze	105 °C	-55 °C	Solder	Black	Tin	0.135 in	Liquid Crystal Polymer (LCP)	Header	Tin	Male Pin	Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A	0.1 in
Samtec Inc. TLW-132-05-G-S	1	Push-Pull	10 µin	All	Square	0.06 in	0.105 in	32	0.335 in	Phosphor Bronze	125 °C	-55 °C	Solder	Black	Gold	0.17 in	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A		Flash	Flash
Samtec Inc. TLW-132-06-G-D	2	Push-Pull	10 µin	All	Square	0.06 in	0.105 in	64	0.3 in	Phosphor Bronze	125 °C	-55 °C	Solder	Black	Gold	0.135 in	Liquid Crystal Polymer (LCP)	Header	Gold	Male Pin	Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A	0.1 in	Flash	Flash
Samtec Inc. TLW-132-05-T-D	2	Push-Pull		All	Square	0.06 in	0.105 in	64	0.335 in	Phosphor Bronze	105 °C	-55 °C	Solder	Black	Tin	0.17 in	Liquid Crystal Polymer (LCP)	Header	Tin	Male Pin	Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A	0.1 in
Samtec Inc. TLW-132-06-T-S	1	Push-Pull		All	Square	0.06 in	0.105 in	32	0.3 in	Phosphor Bronze	105 °C	-55 °C	Solder	Black	Tin	0.135 in	Liquid Crystal Polymer (LCP)	Header	Tin	Male Pin	Through Hole	Unshrouded	Board Board or Cable	0.1 in	5.2 A