HSEC8-130-01-S-PV-4-1
ActiveSamtec Inc.
CONN EDGE DUAL FML 64POS 0.031
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HSEC8-130-01-S-PV-4-1
ActiveSamtec Inc.
CONN EDGE DUAL FML 64POS 0.031
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | HSEC8-130-01-S-PV-4-1 |
|---|---|
| Card Thickness | 0.062 in |
| Card Thickness | 1.57 mm |
| Card Type | Non Specified - Dual Edge |
| Color | Black |
| Contact Finish | Gold |
| Contact Finish Thickness | 0.76 Ám |
| Contact Finish Thickness | 30 Áin |
| Contact Material | Beryllium Copper |
| Contact Type | Cantilever |
| Features | Board Guide |
| Gender | Female |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Mounting Type | Surface Mount, Through Hole |
| Number of Positions | 4, 60 |
| Number of Positions/Bay/Row [custom] | 2 |
| Number of Positions/Bay/Row [custom] | 2 |
| Number of Positions/Bay/Row [custom] | 30 |
| Number of Rows | 2 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -55 °C |
| Pitch [x] | 0.8 mm |
| Pitch [x] | 0.031 in |
| Read Out | Dual |
| Termination | Solder |
HSEC8-130 Series
| Part | Contact Finish Thickness | Contact Finish Thickness | Color | Mounting Type | Card Type | Read Out | Material - Insulation | Number of Rows | Card Thickness | Card Thickness | Number of Positions/Bay/Row [custom] | Contact Material | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Pitch [x] | Pitch [x] | Number of Positions | Contact Type | Gender | Contact Finish | Features | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 10 Áin | 0.25 Ám | Black | Board Edge Straddle Mount | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.062 in | 1.57 mm | 30 | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 60 | Cantilever | Female | Gold | ||||
Samtec Inc. | 10 Áin | 0.25 Ám | Black | Surface Mount | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.062 in | 1.57 mm | 30 | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 60 | Cantilever | Female | Gold | Board Guide Locking Ramp | |||
Samtec Inc. | 10 Áin | 0.25 Ám | Black | Surface Mount | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.062 in | 1.57 mm | 30 | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 60 | Cantilever | Female | Gold | Board Guide Solder Retention | |||
Samtec Inc. | 30 Áin | 0.76 Ám | Black | Surface Mount | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.062 in | 1.57 mm | 30 | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 60 | Cantilever | Female | Gold | ||||
Samtec Inc. | 30 Áin | 0.76 Ám | Black | Surface Mount | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.062 in | 1.57 mm | 30 | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 60 | Cantilever | Female | Gold | Board Guide | |||
Samtec Inc. | 30 Áin | 0.76 Ám | Black | Surface Mount Through Hole | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.062 in | 1.57 mm | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 4 60 | Cantilever | Female | Gold | Board Guide | 2 | 2 | 30 | |
Samtec Inc. | 10 Áin | 0.25 Ám | Black | Surface Mount Through Hole | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.062 in | 1.57 mm | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 4 60 | Cantilever | Female | Gold | Board Guide Solder Retention | 2 | 2 | 30 | |
Samtec Inc. | 10 Áin | 0.25 Ám | Black | Surface Mount | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.062 in | 1.57 mm | 30 | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 60 | Cantilever | Female | Gold | Board Guide Board Lock | |||
Samtec Inc. | 10 Áin | 0.25 Ám | Black | Surface Mount | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.062 in | 1.57 mm | 30 | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 60 | Cantilever | Female | Gold | Board Guide Solder Retention | |||
Samtec Inc. | 10 Áin | 0.25 Ám | Black | Surface Mount | Non Specified - Dual Edge | Dual | Liquid Crystal Polymer (LCP) | 2 | 0.093 in | 2.36 mm | 30 | Beryllium Copper | -55 °C | 125 °C | Solder | 0.8 mm | 0.031 in | 60 | Cantilever | Female | Gold | Board Guide |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 1 | $ 10.65 | |
| 10 | $ 9.85 | |||
| 25 | $ 9.31 | |||
| 50 | $ 8.97 | |||
| 100 | $ 7.96 | |||
Description
General part information
HSEC8-130 Series
64 (60 + 4 Power) Position Female Connector Non Specified - Dual Edge Gold 0.031" (0.80mm) Black
Documents
Technical documentation and resources