HSEC8-130 Series

Catalog

CONN EDGE DUAL FMALE 60POS 0.031

Part	Contact Finish Thickness	Contact Finish Thickness	Color	Mounting Type	Card Type	Read Out	Material - Insulation	Number of Rows	Card Thickness	Card Thickness	Number of Positions/Bay/Row [custom]	Contact Material	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Pitch [x]	Pitch [x]	Number of Positions	Contact Type	Gender	Contact Finish	Features	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]
Samtec Inc. HSEC8-130-01-L-D-EM2	10 Áin	0.25 Ám	Black	Board Edge Straddle Mount	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.062 in	1.57 mm	30	Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	60	Cantilever	Female	Gold
Samtec Inc. HSEC8-130-01-L-DV-A-K-TR	10 Áin	0.25 Ám	Black	Surface Mount	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.062 in	1.57 mm	30	Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	60	Cantilever	Female	Gold	Board Guide Locking Ramp
Samtec Inc. HSEC8-130-01-L-DV-A-WT	10 Áin	0.25 Ám	Black	Surface Mount	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.062 in	1.57 mm	30	Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	60	Cantilever	Female	Gold	Board Guide Solder Retention
Samtec Inc. HSEC8-130-01-SM-DV-K-TR	30 Áin	0.76 Ám	Black	Surface Mount	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.062 in	1.57 mm	30	Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	60	Cantilever	Female	Gold
Samtec Inc. HSEC8-130-01-H-DV-A-K-TR	30 Áin	0.76 Ám	Black	Surface Mount	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.062 in	1.57 mm	30	Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	60	Cantilever	Female	Gold	Board Guide
Samtec Inc. HSEC8-130-01-S-PV-4-1	30 Áin	0.76 Ám	Black	Surface Mount Through Hole	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.062 in	1.57 mm		Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	4 60	Cantilever	Female	Gold	Board Guide	2	2	30
Samtec Inc. HSEC8-130-01-L-PV-4-1-WT	10 Áin	0.25 Ám	Black	Surface Mount Through Hole	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.062 in	1.57 mm		Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	4 60	Cantilever	Female	Gold	Board Guide Solder Retention	2	2	30
Samtec Inc. HSEC8-130-01-L-DV-A-BL-K	10 Áin	0.25 Ám	Black	Surface Mount	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.062 in	1.57 mm	30	Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	60	Cantilever	Female	Gold	Board Guide Board Lock
Samtec Inc. HSEC8-130-01-L-DV-A-WT-TR	10 Áin	0.25 Ám	Black	Surface Mount	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.062 in	1.57 mm	30	Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	60	Cantilever	Female	Gold	Board Guide Solder Retention
Samtec Inc. HSEC8-130-03-L-DV-A-K-TR	10 Áin	0.25 Ám	Black	Surface Mount	Non Specified - Dual Edge	Dual	Liquid Crystal Polymer (LCP)	2	0.093 in	2.36 mm	30	Beryllium Copper	-55 °C	125 °C	Solder	0.8 mm	0.031 in	60	Cantilever	Female	Gold	Board Guide