24-6518-10E
ActiveAries Electronics
CONN IC DIP SOCKET 24POS GOLD
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24-6518-10E
ActiveAries Electronics
CONN IC DIP SOCKET 24POS GOLD
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DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 24-6518-10E |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Open Frame |
| Housing Material | Glass Filled, Polyamide (PA46), Nylon 4/6 |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 24 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 3.18 mm |
| Termination Post Length | 0.125 in |
| Type | DIP |
| Type | 0.6 in |
| Type | 15.24 mm |
24-6518 Series
| Part | Material Flammability Rating | Contact Material - Post [custom] | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Contact Finish - Mating | Type | Type | Type | Current Rating (Amps) | Housing Material | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Number of Positions or Pins (Grid) | Termination | Features | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Gold | DIP | 0.6 in | 15.24 mm | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | 24 | Solder | Open Frame | Tin |
Aries Electronics | UL94 V-0 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Gold | DIP | 0.6 in | 15.24 mm | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | 24 | Solder | Open Frame | Tin |
Aries Electronics | UL94 V-0 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Gold | DIP | 0.6 in | 15.24 mm | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | 24 | Solder | Open Frame | Tin |
Aries Electronics | UL94 V-0 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Gold | DIP | 0.6 in | 15.24 mm | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | 24 | Solder | Open Frame | Tin |
Aries Electronics | UL94 V-0 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Gold | DIP | 0.6 in | 15.24 mm | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | 24 | Solder | Open Frame | Tin |
Aries Electronics | UL94 V-0 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Gold | DIP | 0.6 in | 15.24 mm | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | 24 | Solder | Open Frame | Tin |
Aries Electronics | UL94 V-0 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | Gold | DIP | 0.6 in | 15.24 mm | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | 24 | Solder | Open Frame | Gold |
Aries Electronics | UL94 V-0 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Gold | DIP | 0.6 in | 15.24 mm | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Surface Mount | 24 | Solder | Open Frame | Tin |
Aries Electronics | UL94 V-0 | Brass | Beryllium Copper | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 3.18 mm | 0.125 in | Gold | DIP | 0.6 in | 15.24 mm | 3 A | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 10 çin | 0.25 çm | Through Hole | 24 | Solder | Open Frame | Tin |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 60 | $ 8.56 | |
Description
General part information
24-6518 Series
24 (2 x 12) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources