24-6518 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Material Flammability Rating	Contact Material - Post [custom]	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Contact Finish - Mating	Type	Type	Type	Current Rating (Amps)	Housing Material	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Number of Positions or Pins (Grid)	Termination	Features	Contact Finish - Post
Aries Electronics 24-6518-10E	UL94 V-0	Brass	Beryllium Copper	0.1 in	2.54 mm	200 µin	5.08 µm	3.18 mm	0.125 in	Gold	DIP	0.6 in	15.24 mm	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm	Through Hole	24	Solder	Open Frame	Tin
Aries Electronics 24-6518-10M	UL94 V-0	Brass	Beryllium Copper	0.1 in	2.54 mm	200 µin	5.08 µm	3.18 mm	0.125 in	Gold	DIP	0.6 in	15.24 mm	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm	Through Hole	24	Solder	Open Frame	Tin
Aries Electronics 24-6518-10	UL94 V-0	Brass	Beryllium Copper	0.1 in	2.54 mm	200 µin	5.08 µm	3.18 mm	0.125 in	Gold	DIP	0.6 in	15.24 mm	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm	Through Hole	24	Solder	Open Frame	Tin
Aries Electronics 24-6518-101H	UL94 V-0	Brass	Beryllium Copper	0.1 in	2.54 mm	200 µin	5.08 µm	3.18 mm	0.125 in	Gold	DIP	0.6 in	15.24 mm	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm	Through Hole	24	Solder	Open Frame	Tin
Aries Electronics 24-6518-10T	UL94 V-0	Brass	Beryllium Copper	0.1 in	2.54 mm	200 µin	5.08 µm	3.18 mm	0.125 in	Gold	DIP	0.6 in	15.24 mm	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm	Through Hole	24	Solder	Open Frame	Tin
Aries Electronics 24-6518-10H	UL94 V-0	Brass	Beryllium Copper	0.1 in	2.54 mm	200 µin	5.08 µm	3.18 mm	0.125 in	Gold	DIP	0.6 in	15.24 mm	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm	Through Hole	24	Solder	Open Frame	Tin
Aries Electronics 24-6518-11H	UL94 V-0	Brass	Beryllium Copper	0.1 in	2.54 mm	10 çin	0.25 çm	3.18 mm	0.125 in	Gold	DIP	0.6 in	15.24 mm	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm	Through Hole	24	Solder	Open Frame	Gold
Aries Electronics 24-6518-00	UL94 V-0	Brass	Beryllium Copper	0.1 in	2.54 mm	200 µin	5.08 µm	3.18 mm	0.125 in	Gold	DIP	0.6 in	15.24 mm	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm	Surface Mount	24	Solder	Open Frame	Tin
Aries Electronics 24-6518-102	UL94 V-0	Brass	Beryllium Copper	0.1 in	2.54 mm	200 µin	5.08 µm	3.18 mm	0.125 in	Gold	DIP	0.6 in	15.24 mm	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	10 çin	0.25 çm	Through Hole	24	Solder	Open Frame	Tin