24-6518 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Material Flammability Rating	Current Rating	Termination Post Length	Pitch - Post	Features	Contact Finish Thickness - Mating	Pitch - Mating	Contact Material - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Material - Post	Contact Finish - Mating	Contact Finish Thickness - Post	Row Spacing	Type	Housing Material	Contact Finish - Post	Mounting Type	Termination
Aries Electronics 24-6518-10E	UL94 V-0	3 A	0.125 in	0.1 in	Open Frame	10 µin	0.1 in	Beryllium Copper	2	24	12	Brass	Gold	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	Through Hole	Solder
Aries Electronics 24-6518-01	UL94 V-0	3 A	0.125 in	0.1 in	Open Frame	10 µin	0.1 in	Beryllium Copper	2	24	12	Brass	Gold	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	Through Hole	Solder
Aries Electronics 24-6518-10	UL94 V-0	3 A	0.125 in	0.1 in	Open Frame	10 µin	0.1 in	Beryllium Copper	2	24	12	Brass	Gold	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	Through Hole	Solder
Aries Electronics 24-6518-101H	UL94 V-0	3 A	0.125 in	0.1 in	Open Frame	10 µin	0.1 in	Beryllium Copper	2	24	12	Brass	Gold	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	Through Hole	Solder
Aries Electronics 24-6518-10H	UL94 V-0	3 A	0.125 in	0.1 in	Open Frame	10 µin	0.1 in	Beryllium Copper	2	24	12	Brass	Gold	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	Through Hole	Solder
Aries Electronics 24-6518-101	UL94 V-0	3 A	0.125 in	0.1 in	Open Frame	10 µin	0.1 in	Beryllium Copper	2	24	12	Brass	Gold	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	Through Hole	Solder
Aries Electronics 24-6518-11H	UL94 V-0	3 A	0.125 in	0.1 in	Open Frame	10 µin	0.1 in	Beryllium Copper	2	24	12	Brass	Gold	10 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Gold	Through Hole	Solder
Aries Electronics 24-6518-00	UL94 V-0	3 A	0.125 in	0.1 in	Open Frame	10 µin	0.1 in	Beryllium Copper	2	24	12	Brass	Gold	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	Surface Mount	Solder
Aries Electronics 24-6518-102	UL94 V-0	3 A	0.125 in	0.1 in	Open Frame	10 µin	0.1 in	Beryllium Copper	2	24	12	Brass	Gold	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	Tin	Through Hole	Solder