TFM-117-01-L-S

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Samtec Inc.

CONN HEADER VERT 17POS 1.27MM

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TFM-117-01-L-S

Active

Samtec Inc.

CONN HEADER VERT 17POS 1.27MM

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TFM-117-01-L-S

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	15 µin
Contact Finish Thickness - Mating	0.38 µm
Contact Length - Mating	3.33 mm
Contact Length - Mating	0.131 in
Contact Length - Post [x]	0.078 in
Contact Length - Post [x]	1.98 mm
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	2.9 A
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	5.6 mm
Insulation Height	0.22 in
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Shrouding	Shrouded - 4 Wall
Style	Board to Board, Cable
Termination	Solder
Voltage Rating	275 VAC

TFM-117 Series

Part	Contact Finish - Mating	Shrouding	Operating Temperature [Min]	Operating Temperature [Max]	Contact Shape	Contact Finish - Post	Insulation Height	Insulation Height	Fastening Type	Insulation Color	Termination	Material Flammability Rating	Insulation Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Mounting Type	Number of Positions Loaded	Contact Type	Contact Length - Mating	Contact Length - Mating	Contact Material	Voltage Rating	Number of Positions	Pitch - Mating	Pitch - Mating	Row Spacing - Mating	Row Spacing - Mating	Style	Number of Rows	Connector Type	Features	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Post	Contact Length - Post
Samtec Inc. TFM-117-02-S-D	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	5.6 mm	0.22 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	30 Áin	0.76 Ám	2.9 A	Surface Mount	All	Male Pin	3.33 mm	0.131 in	Phosphor Bronze	275 VAC	34	0.05 in	1.27 mm	0.05 in	1.27 mm	Board to Board Cable	2	Header
Samtec Inc. TFM-117-12-STL-D-A-P	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	7.37 mm	0.29 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	30 Áin	0.76 Ám	2.9 A	Surface Mount	All	Male Pin	3.53 mm	0.139 in	Phosphor Bronze	275 VAC	34	0.05 in	1.27 mm	0.05 in	1.27 mm	Board to Board Cable	2	Header	Board Guide Pick and Place
Samtec Inc. TFM-117-01-L-S	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	5.6 mm	0.22 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	15 µin	0.38 µm	2.9 A	Through Hole	All	Male Pin	3.33 mm	0.131 in	Phosphor Bronze	275 VAC		0.05 in	1.27 mm			Board to Board Cable	1	Header		0.078 in	1.98 mm
Samtec Inc. TFM-117-01-L-S-RA	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	4.45 mm	0.175 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	10 çin	0.25 çm	2.9 A	Through Hole Right Angle	All	Male Pin	3.48 mm	0.137 in	Phosphor Bronze	275 VAC		0.05 in	1.27 mm			Board to Board Cable	1	Header				0.084 in	2.13 mm
Samtec Inc. TFM-117-13-S-D	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	7.37 mm	0.29 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	30 Áin	0.76 Ám	2.9 A	Through Hole	All	Male Pin	3.53 mm	0.139 in	Phosphor Bronze	275 VAC	34	0.05 in	1.27 mm	0.05 in	1.27 mm	Board to Board Cable	2	Header				0.111 in	2.82 mm
Samtec Inc. TFM-117-02-L-D-WT	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	5.6 mm	0.22 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	15 µin	0.38 µm	2.9 A	Surface Mount	All	Male Pin	3.33 mm	0.131 in	Phosphor Bronze	275 VAC	34	0.05 in	1.27 mm	0.05 in	1.27 mm	Board to Board Cable	2	Header	Solder Retention
Samtec Inc. TFM-117-01-L-D-RA	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	5.72 mm	0.225 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	15 µin	0.38 µm	3.2 A	Through Hole Right Angle	All	Male Pin	3.61 mm	0.142 in	Phosphor Bronze	275 VAC	34	0.05 in	1.27 mm	0.05 in	1.27 mm	Board to Board Cable	2	Header		0.075 in			1.91 mm
Samtec Inc. TFM-117-02-L-D	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	5.6 mm	0.22 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	15 µin	0.38 µm	2.9 A	Surface Mount	All	Male Pin	3.33 mm	0.131 in	Phosphor Bronze	275 VAC	34	0.05 in	1.27 mm	0.05 in	1.27 mm	Board to Board Cable	2	Header
Samtec Inc. TFM-117-03-S-D	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	5.6 mm	0.22 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	30 Áin	0.76 Ám	2.9 A	Through Hole	All	Male Pin	3.53 mm	0.139 in	Phosphor Bronze	275 VAC	34	0.05 in	1.27 mm	0.05 in	1.27 mm	Board to Board Cable	2	Header				0.111 in	2.82 mm
Samtec Inc. TFM-117-02-S-DH	Gold	Shrouded - 4 Wall	-55 °C	125 °C	Square	Tin	5.72 mm	0.225 in	Push-Pull	Black	Solder	UL94 V-0	Liquid Crystal Polymer (LCP)	30 Áin	0.76 Ám	2.9 A	Surface Mount Right Angle	All	Male Pin	3.81 mm	0.15 in	Phosphor Bronze	275 VAC	34	0.05 in	1.27 mm	0.05 in	1.27 mm	Board to Board Cable	2	Header	Board Guide

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 4.47

Description

General part information

TFM-117 Series

Connector Header Through Hole 17 position 0.050" (1.27mm)

Documents

Technical documentation and resources

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