TFM-117 Series

Catalog

CONN HEADER SMD 34POS 1.27MM

Part	Current Rating (Per Contact)	Pitch - Mating	Contact Finish - Mating	Material Flammability Rating	Voltage Rating	Contact Length - Mating	Number of Positions Loaded	Contact Finish - Post	Insulation Color	Contact Shape	Insulation Material	Contact Material	Contact Finish Thickness - Mating	Row Spacing - Mating	Shrouding	Fastening Type	Termination	Number of Rows	Style	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Connector Type	Number of Positions	Insulation Height	Contact Type	Features	Contact Length - Post	Contact Finish Thickness - Post
Samtec Inc. TFM-117-02-S-D	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.131 in	All	Tin	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	30 µin	0.05 in	Shrouded - 4 Wall	Push-Pull	Solder	2	Board Board or Cable	Surface Mount	125 °C	-55 °C	Header	34	0.22 in	Male Pin
Samtec Inc. TFM-117-12-STL-D-A-P	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.139 in	All	Tin	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	30 µin	0.05 in	Shrouded - 4 Wall	Push-Pull	Solder	2	Board Board or Cable	Surface Mount	125 °C	-55 °C	Header	34	0.29 in	Male Pin	Board Guide Pick and Place
Samtec Inc. TFM-117-01-L-S	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.131 in	All	Tin	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	15 µin		Shrouded - 4 Wall	Push-Pull	Solder	1	Board Board or Cable	Through Hole	125 °C	-55 °C	Header	17	0.22 in	Male Pin		0.078 in
Samtec Inc. TFM-117-01-L-D-LC	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.131 in	All	Tin	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	10 µin 15 µin	0.05 in	Shrouded - 4 Wall	Push-Pull	Solder	2	Board Board or Cable	Through Hole	125 °C	-55 °C	Header	34	0.22 in	Male Pin	Board Lock	0.078 in
Samtec Inc. TFM-117-02-H-D-A	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.131 in	All	Gold	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	30 µin	0.05 in	Shrouded - 4 Wall	Push-Pull	Solder	2	Board Board or Cable	Surface Mount	125 °C	-55 °C	Header	34	0.22 in	Male Pin	Board Guide		3 µin
Samtec Inc. TFM-117-02-L-D-A	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.131 in	All	Tin	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	10 µin 15 µin	0.05 in	Shrouded - 4 Wall	Push-Pull	Solder	2	Board Board or Cable	Surface Mount	125 °C	-55 °C	Header	34	0.22 in	Male Pin	Board Guide
Samtec Inc. TFM-117-01-L-S-RA	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.137 in	All	Tin	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	10 µin 15 µin		Shrouded - 4 Wall	Push-Pull	Solder	1	Board Board or Cable	Right Angle Through Hole	125 °C	-55 °C	Header	17	0.175 in	Male Pin		0.084 in
Samtec Inc. TFM-117-03-L-D	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.139 in	All	Tin	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	10 µin 15 µin	0.05 in	Shrouded - 4 Wall	Push-Pull	Solder	2	Board Board or Cable	Through Hole	125 °C	-55 °C	Header	34	0.22 in	Male Pin		0.111 in
Samtec Inc. TFM-117-01-L-D-RE2-WT	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.139 in	All	Tin	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	10 µin 15 µin	0.05 in	Shrouded - 4 Wall	Push-Pull	Solder	2	Board Board or Cable	Right Angle Through Hole	125 °C	-55 °C	Elevated Header	34	0.24 in	Male Pin	Solder Retention	0.11 in
Samtec Inc. TFM-117-13-S-D	2.9 A 3.2 A 3.7 A	0.05 in	Gold	UL94 V-0	250 V 275 VAC	0.139 in	All	Tin	Black	Square	Liquid Crystal Polymer (LCP)	Phosphor Bronze	30 µin	0.05 in	Shrouded - 4 Wall	Push-Pull	Solder	2	Board Board or Cable	Through Hole	125 °C	-55 °C	Header	34	0.29 in	Male Pin		0.111 in