SEAMP-50-02.0-S-06

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Samtec Inc.

CONN HD ARRAY M 300POS PRESS-FIT

Search across all available documentation for this part.

Active

Samtec Inc.

CONN HD ARRAY M 300POS PRESS-FIT

Technical Specifications

Parameters and characteristics for this part

Part	Mated Stacking Heights	Connector Type	Contact Finish Thickness	Contact Finish Thickness	Number of Rows	Mounting Type	Number of Positions	Contact Finish	Pitch [x]	Pitch [x]	Height Above Board	Height Above Board	Features
Samtec Inc. SEAMP-50-02.0-L-10-GP	7 mm 8 mm 8.5 mm	High Density Array Male	10 Áin	0.25 Ám	10	Through Hole	500	Gold	0.05 in	1.27 mm	0.181 in	4.6 mm	Board Guide
Samtec Inc. SEAMP-50-02.0-S-10-GP	7 mm 8 mm 8.5 mm	High Density Array Male	30 Áin	0.76 Ám	10	Through Hole	500	Gold	0.05 in	1.27 mm	0.181 in	4.6 mm	Board Guide
Samtec Inc. SEAMP-50-02.0-S-06	7 mm 8 mm 8.5 mm	High Density Array Male	30 Áin	0.76 Ám	6	Through Hole	300	Gold	0.05 in	1.27 mm	0.181 in	4.6 mm
Samtec Inc. SEAMP-50-02.0-S-08	7 mm 8 mm 8.5 mm	High Density Array Male	30 Áin	0.76 Ám	8	Through Hole	400	Gold	0.05 in	1.27 mm	0.181 in	4.6 mm
Samtec Inc. SEAMP-50-02.0-L-06	7 mm 8 mm 8.5 mm	High Density Array Male	10 Áin	0.25 Ám	6	Through Hole	300	Gold	0.05 in	1.27 mm	0.181 in	4.6 mm
Samtec Inc. SEAMP-50-02.0-L-10	7 mm 8 mm 8.5 mm	High Density Array Male	10 Áin	0.25 Ám	10	Through Hole	500	Gold	0.05 in	1.27 mm	0.181 in	4.6 mm

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	33	$ 23.04

General part information

300 Position Connector High Density Array, Male Through Hole Gold

Technical documentation and resources