Specification	SEAMP-50-02.0-S-10-GP

Connector Type	MALE, High Density Array
Contact Finish	Gold
Contact Finish Thickness	30 µin
Features	Board Guide
Height Above Board	0.181 in
Mated Stacking Height Options	7mm, 8mm, 8.5mm
Mounting Type	Through Hole
Number of Positions	500
Number of Rows	10
Pitch	0.05 in

SEAMP-50 Series

Part	Pitch	Number of Positions	Contact Finish	Connector Type	Features	Contact Finish Thickness	Number of Rows	Mated Stacking Height Options	Mounting Type	Height Above Board
Samtec Inc. SEAMP-50-02.0-L-10-GP	0.05 in	500	Gold	High Density Array MALE	Board Guide	10 Ąin	10	7mm 8.5mm 8mm	Through Hole	0.181 in
Samtec Inc. SEAMP-50-02.0-S-10-GP	0.05 in	500	Gold	High Density Array MALE	Board Guide	30 µin	10	7mm 8.5mm 8mm	Through Hole	0.181 in
Samtec Inc. SEAMP-50-02.0-S-06	0.05 in	300	Gold	High Density Array MALE		30 µin	6	7mm 8.5mm 8mm	Through Hole	0.181 in
Samtec Inc. SEAMP-50-02.0-S-08	0.05 in	400	Gold	High Density Array MALE		30 µin	8	7mm 8.5mm 8mm	Through Hole	0.181 in
Samtec Inc. SEAMP-50-02.0-L-06	0.05 in	300	Gold	High Density Array MALE		10 Ąin	6	7mm 8.5mm 8mm	Through Hole	0.181 in
Samtec Inc. SEAMP-50-02.0-L-10	0.05 in	500	Gold	High Density Array MALE		10 Ąin	10	7mm 8.5mm 8mm	Through Hole	0.181 in

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