04-1518-00

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Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

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04-1518-00

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Aries Electronics

CONN IC DIP SOCKET 4POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	04-1518-00

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions or Pins (Grid) [custom]	4
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	DIP
Type	5.08 mm
Type	0.2 in

04-1518 Series

Part	Pitch - Post	Pitch - Post	Termination	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Contact Material - Mating	Contact Material - Post [custom]	Features	Mounting Type	Type	Type	Type	Contact Finish - Post	Number of Positions or Pins (Grid) [custom]	Current Rating (Amps)	Housing Material
Aries Electronics 04-1518-10T	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Through Hole	DIP	5.08 mm	0.2 in	Tin	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 04-1518-00	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Surface Mount	DIP	5.08 mm	0.2 in	Tin	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 04-1518-10	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Through Hole	DIP	5.08 mm	0.2 in	Tin	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 04-1518-10H	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Through Hole	DIP	5.08 mm	0.2 in	Tin	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 04-1518-11	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	10 çin	0.25 çm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Through Hole	DIP	5.08 mm	0.2 in	Gold	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	807	$ 0.55

Description

General part information

04-1518 Series

4 (2 x 2) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Surface Mount

Documents

Technical documentation and resources