04-1518 Series

Catalog

CONN IC DIP SOCKET 4POS GOLD

Part	Pitch - Post	Pitch - Post	Termination	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Material Flammability Rating	Contact Material - Mating	Contact Material - Post [custom]	Features	Mounting Type	Type	Type	Type	Contact Finish - Post	Number of Positions or Pins (Grid) [custom]	Current Rating (Amps)	Housing Material
Aries Electronics 04-1518-10T	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Through Hole	DIP	5.08 mm	0.2 in	Tin	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 04-1518-00	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Surface Mount	DIP	5.08 mm	0.2 in	Tin	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 04-1518-10	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Through Hole	DIP	5.08 mm	0.2 in	Tin	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 04-1518-10H	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	200 µin	5.08 µm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Through Hole	DIP	5.08 mm	0.2 in	Tin	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 04-1518-11	2.54 mm	0.1 in	Solder	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	10 çin	0.25 çm	UL94 V-0	Beryllium Copper	Brass	Open Frame	Through Hole	DIP	5.08 mm	0.2 in	Gold	4	3 A	Glass Filled Nylon 4/6 Polyamide (PA46)