TSM-130-01-G-DV

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Samtec Inc.

CONN HEADER SMD 60POS 2.54MM

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TSM-130-01-G-DV

Active

Samtec Inc.

CONN HEADER SMD 60POS 2.54MM

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TSM-130-01-G-DV

Connector Type	Cuttable, Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	5.84 mm
Contact Length - Mating [x]	0.23 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Insulation Height	2.54 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	60
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

TSM-130 Series

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Part	Contact Length - Post [x]	Contact Length - Post [x]	Style	Termination	Number of Rows	Number of Positions Loaded	Contact Finish - Post	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Number of Positions	Insulation Material	Shrouding	Contact Shape	Contact Material	Contact Length - Mating [x]	Contact Length - Mating	Connector Type	Insulation Color	Fastening Type	Insulation Height	Insulation Height	Contact Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Length - Mating	Contact Finish - Mating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. TSM-130-02-L-SV
Samtec Inc. TSM-130-01-TL-TM	9.78 mm	0.385 in	Board to Board Cable	Solder	3	All	Tin	105 ░C	-55 °C	Surface Mount Through Hole	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	90	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze	0.23 in	5.84 mm	Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin
Samtec Inc. TSM-130-04-L-DV-LC			Board to Board Cable	Solder	2	All	Tin	125 °C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		3.05 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	10 çin	0.25 çm	0.12 in	Gold
Samtec Inc. TSM-130-03-S-DV-P			Board to Board Cable	Solder	2	All	Tin	125 °C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		10.67 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	30 Áin	0.76 Ám	0.42 in	Gold	Pick and Place
Samtec Inc. TSM-130-03-S-SV-P			Board to Board Cable	Solder	1	All	Tin	125 °C	-55 °C	Surface Mount			0.1 in	2.54 mm	UL94 V-0	30	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		10.67 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	30 Áin	0.76 Ám	0.42 in	Gold	Pick and Place
Samtec Inc. TSM-130-01-L-DH			Board to Board Cable	Solder	2	All	Tin	125 °C	-55 °C	Surface Mount Right Angle	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze	0.23 in	5.84 mm	Header	Black	Push-Pull	0.24 in	6.1 mm	Male Pin	10 çin	0.25 çm		Gold
Samtec Inc. TSM-130-01-T-DV-LC			Board to Board Cable	Solder	2	All	Tin	105 ░C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze	0.23 in	5.84 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin
Samtec Inc. TSM-130-04-T-SH-A			Board to Board Cable	Solder	1	All	Tin	105 ░C	-55 °C	Surface Mount Right Angle			0.1 in	2.54 mm	UL94 V-0	30	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		3.05 mm	Header	Black	Push-Pull	0.12 in	3.05 mm	Male Pin			0.12 in		Board Guide
Samtec Inc. TSM-130-01-G-DV			Board to Board Cable	Solder	2	All	Gold	125 °C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze	0.23 in	5.84 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	10 çin	0.25 çm		Gold		3 µin	0.076 µm
Samtec Inc. TSM-130-04-L-SV			Board to Board Cable	Solder	1	All	Tin	125 °C	-55 °C	Surface Mount			0.1 in	2.54 mm	UL94 V-0	30	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		3.05 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	10 çin	0.25 çm	0.12 in	Gold

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	7	$ 7.18

Description

General part information

TSM-130 Series

Connector Header Surface Mount 60 position 0.100" (2.54mm)

Documents

Technical documentation and resources