TSM-130 Series

Catalog

VERTICAL WELDING TIN 30P -55℃~+125℃ 2.54MM BLACK SINGLE ROW PHOSPHOR BRONZE SMD,P=2.54MM PIN HEADERS ROHS

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Part	Contact Length - Post [x]	Contact Length - Post [x]	Style	Termination	Number of Rows	Number of Positions Loaded	Contact Finish - Post	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Number of Positions	Insulation Material	Shrouding	Contact Shape	Contact Material	Contact Length - Mating [x]	Contact Length - Mating	Connector Type	Insulation Color	Fastening Type	Insulation Height	Insulation Height	Contact Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Length - Mating	Contact Finish - Mating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. TSM-130-02-L-SV
Samtec Inc. TSM-130-01-TL-TM	9.78 mm	0.385 in	Board to Board Cable	Solder	3	All	Tin	105 ░C	-55 °C	Surface Mount Through Hole	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	90	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze	0.23 in	5.84 mm	Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin
Samtec Inc. TSM-130-04-L-DV-LC			Board to Board Cable	Solder	2	All	Tin	125 °C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		3.05 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	10 çin	0.25 çm	0.12 in	Gold
Samtec Inc. TSM-130-03-S-DV-P			Board to Board Cable	Solder	2	All	Tin	125 °C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		10.67 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	30 Áin	0.76 Ám	0.42 in	Gold	Pick and Place
Samtec Inc. TSM-130-03-S-SV-P			Board to Board Cable	Solder	1	All	Tin	125 °C	-55 °C	Surface Mount			0.1 in	2.54 mm	UL94 V-0	30	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		10.67 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	30 Áin	0.76 Ám	0.42 in	Gold	Pick and Place
Samtec Inc. TSM-130-01-L-DH			Board to Board Cable	Solder	2	All	Tin	125 °C	-55 °C	Surface Mount Right Angle	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze	0.23 in	5.84 mm	Header	Black	Push-Pull	0.24 in	6.1 mm	Male Pin	10 çin	0.25 çm		Gold
Samtec Inc. TSM-130-01-T-DV-LC			Board to Board Cable	Solder	2	All	Tin	105 ░C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze	0.23 in	5.84 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin
Samtec Inc. TSM-130-04-T-SH-A			Board to Board Cable	Solder	1	All	Tin	105 ░C	-55 °C	Surface Mount Right Angle			0.1 in	2.54 mm	UL94 V-0	30	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		3.05 mm	Header	Black	Push-Pull	0.12 in	3.05 mm	Male Pin			0.12 in		Board Guide
Samtec Inc. TSM-130-01-G-DV			Board to Board Cable	Solder	2	All	Gold	125 °C	-55 °C	Surface Mount	2.54 mm	0.1 in	0.1 in	2.54 mm	UL94 V-0	60	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze	0.23 in	5.84 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	10 çin	0.25 çm		Gold		3 µin	0.076 µm
Samtec Inc. TSM-130-04-L-SV			Board to Board Cable	Solder	1	All	Tin	125 °C	-55 °C	Surface Mount			0.1 in	2.54 mm	UL94 V-0	30	Liquid Crystal Polymer (LCP)	Unshrouded	Square	Phosphor Bronze		3.05 mm	Cuttable Header	Black	Push-Pull	0.1 in	2.54 mm	Male Pin	10 çin	0.25 çm	0.12 in	Gold