628-35AB

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Wakefield-Vette

HEATSINK FOR 45MM BGA

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Wakefield-Vette

HEATSINK FOR 45MM BGA

Technical Specifications

Parameters and characteristics for this part

Specification	628-35AB

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	8.89 mm
Fin Height	0.35 in
Length	44.45 mm
Length	1.75 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	150 LFM, 10 °C/W
Type	Top Mount
Width [x]	43.18 mm
Width [x]	1.7 in

Part	Attachment Method	Length	Length	Package Cooled	Material Finish	Shape	Material	Thermal Resistance @ Forced Air Flow	Type	Width [x]	Width [x]	Fin Height	Fin Height
Wakefield-Vette 628-35AB	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	ASIC BGA CPU LGA	Black Anodized	Pin Fins Square	Aluminum	10 °C/W 150 LFM	Top Mount	43.18 mm	1.7 in	8.89 mm	0.35 in
Wakefield-Vette 628-35ABT5	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	ASIC BGA CPU LGA	Black Anodized	Pin Fins Square	Aluminum	10 °C/W 150 LFM	Top Mount	43.18 mm	1.7 in	8.89 mm	0.35 in
Wakefield-Vette 628-35ABT1E	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	ASIC BGA CPU LGA	Black Anodized	Pin Fins Square	Aluminum	10 °C/W 150 LFM	Top Mount	43.18 mm	1.7 in	8.89 mm	0.35 in
Wakefield-Vette 628-35ABT4E	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	ASIC BGA CPU LGA	Black Anodized	Pin Fins Square	Aluminum	10 °C/W 150 LFM	Top Mount	43.18 mm	1.7 in	8.89 mm	0.35 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 3.0W @ 50°C Top Mount

Technical documentation and resources